Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8916481 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Kah Wee Gan, Yaohuang Huang | 2014-12-23 |
| 8912653 | Plasma treatment on semiconductor wafers | Kah Wee Gan, Anandan Ramasamy, Yun Liu | 2014-12-16 |
| 8860207 | Method of fabricating land grid array semiconductor package | Romain Coffy, Jerome Teysseyre | 2014-10-14 |
| 8860228 | Electronic device including electrically conductive vias having different cross-sectional areas and related methods | Yun Liu, Yaohuang Huang | 2014-10-14 |
| 8836117 | Electronic device having a contact recess and related methods | How Yuan Hwang | 2014-09-16 |
| 8796139 | Embedded wafer level ball grid array bar systems and methods | Anandan Ramasamy, Yun Liu | 2014-08-05 |
| 8779601 | Embedded wafer level package for 3D and package-on-package applications, and method of manufacture | Kah Wee Gan, Yaohuang Huang | 2014-07-15 |
| 8766422 | Through hole via filling using electroless plating | Kah Wee Gan, Yun Liu, Yaohuang Huang | 2014-07-01 |
| 8728831 | Reconstituted wafer warpage adjustment | Kah Wee Gan | 2014-05-20 |
| 8664044 | Method of fabricating land grid array semiconductor package | Romain Coffy, Jerome Teysseyre | 2014-03-04 |
| 8617987 | Through hole via filling using electroless plating | Kah Wee Gan, Yun Liu, Yaohuang Huang | 2013-12-31 |
| 8535980 | Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package | Puay Gek Chua | 2013-09-17 |
| 8349710 | Shielding techniques for an integrated circuit | — | 2013-01-08 |
| 8119454 | Manufacturing fan-out wafer level packaging | — | 2012-02-21 |
| 7443039 | System for different bond pads in an integrated circuit package | Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Jae Yong SONG, Won Sun Shin | 2008-10-28 |
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board | Shelley Yong, Puay Gek Chua, Won Sun Shin | 2007-12-11 |
| 7005370 | Method of manufacturing different bond pads on the same substrate of an integrated circuit package | Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Jae Yong SONG, Won Sun Shin | 2006-02-28 |