Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10840202 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-11-17 |
| 10833035 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-11-10 |
| 10797011 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2020-10-06 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Kazushige Toriyama, Ting-Li Yang | 2019-04-09 |
| 10115692 | Method of forming solder bumps | Toyohiro Aoki, Takashi Hisada, Hiroyuki Mori, Eiji Nakamura | 2018-10-30 |
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keiji Matsumoto, Keishi Okamoto, Kazushige Toriyama | 2018-04-10 |
| 9698119 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Kazushige Toriyama | 2017-07-04 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Kazushige Toriyama, Ting-Li Yang | 2017-03-07 |
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Kazushige Toriyama, Shintaro Yamamichi | 2016-12-13 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Kuniaki Sueoka, Kazushige Toriyama | 2016-10-11 |
| 9391034 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Kazushige Toriyama | 2016-07-12 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Kuniaki Sueoka, Kazushige Toriyama | 2016-06-21 |
| 9099315 | Mounting structure and mounting structure manufacturing method | Sayuri Hada, Kei Kawase, Keiji Matsumoto, Kazushige Toriyama | 2015-08-04 |
| 7682936 | Reduction in thickness of semiconductor component on substrate | Toshihiko Nishio, Yukifumi Oyama | 2010-03-23 |
| 7674651 | Mounting method for semiconductor parts on circuit substrate | Yukifumi Oyama, Hidetoshi Nishiwaki, Toshihiko Nishio, Kazushige Toriyama | 2010-03-09 |
| 7605075 | Multilayer circuit board and method of manufacturing the same | Shuichl Okabe, Mitsuya Ishida | 2009-10-20 |
| 5878942 | Soldering method and soldering apparatus | Yasushi Kodama, Shuhei Tsuchita, Yutaka Tsukada, Hideo Ohkuma | 1999-03-09 |