Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7443039 | System for different bond pads in an integrated circuit package | Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG | 2008-10-28 |
| RE40112 | Semiconductor package and method for fabricating the same | Do Sung Chun, Sang Ho Lee, Seon Goo Lee, Vincent DiCaprio | 2008-02-26 |
| 7306133 | System for fabricating an integrated circuit package on a printed circuit board | Yonggang Jin, Shelley Yong, Puay Gek Chua | 2007-12-11 |
| 7211900 | Thin semiconductor package including stacked dies | Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio | 2007-05-01 |
| 7190071 | Semiconductor package and method for fabricating the same | Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2007-03-13 |
| 7005370 | Method of manufacturing different bond pads on the same substrate of an integrated circuit package | Lun Zhao, Wan Lay Looi, Kyaw Oo Aung, Yonggang Jin, Jae Yong SONG | 2006-02-28 |
| 6982488 | Semiconductor package and method for fabricating the same | Do Sung Chun, Soon Goo Lee, Il Kwon Shim, Vincent DiCaprio | 2006-01-03 |
| 6940169 | Torch bump | Yong Jin | 2005-09-06 |
| 6798049 | Semiconductor package and method for fabricating the same | Do Sung Chun, Seon Goo Lee, Il Kwon Shim, Vincent DiCaprio | 2004-09-28 |
| 6740577 | Method of forming a small pitch torch bump for mounting high-performance flip-flop devices | Yong Jin | 2004-05-25 |
| 6717248 | Semiconductor package and method for fabricating the same | Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2004-04-06 |
| 6515356 | Semiconductor package and method for fabricating the same | Seon Goo Lee, Do Sung Chun, Tae Hoan Jang, Vincent DiCaprio | 2003-02-04 |
| 6469258 | Circuit board for semiconductor package | Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Seon Goo Lee, Won Kyun Lee +2 more | 2002-10-22 |
| 6150709 | Grid array type lead frame having lead ends in different planes | Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han | 2000-11-21 |
| 5866939 | Lead end grid array semiconductor package | Byung Joon Han, Ju Hoon Yoon, Sung Bum Kwak, In Gyu Han | 1999-02-02 |
| 5854511 | Semiconductor package including heat sink with layered conductive plate and non-conductive tape bonding to leads | Won Kyun Lee | 1998-12-29 |
| 5807768 | Method for fabricating a heat sink-integrated semiconductor package | — | 1998-09-15 |
| 5723899 | Semiconductor lead frame having connection bar and guide rings | — | 1998-03-03 |
| 5629561 | Semiconductor package with integral heat dissipator | Byung Tai Do | 1997-05-13 |