Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192748 | Controlling of etch depth in deep via etching processes and resultant structures | Patrick A. Raymond, John C. S. Hall, Damyon L. Corbin | 2019-01-29 |
| 8806740 | Silicon chicklet pedestal | S. Jay Chey, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2014-08-19 |
| 8595919 | Silicon chicklet pedestal | S. Jay Chey, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2013-12-03 |
| 8163602 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape | Donald W. Brouillette, Steven A. Martel, Matthew R. Whalen | 2012-04-24 |
| 8034718 | Method to recover patterned semiconductor wafers for rework | Steven R. Codding, David Domina, James L. Hardy | 2011-10-11 |
| 7987591 | Method of forming silicon chicklet pedestal | S. Jay Chey, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia K. Tsang | 2011-08-02 |
| 7932614 | Method of thinning a semiconductor substrate | Steven R. Codding, Timothy E. Neary, Edmund J. Sprogis | 2011-04-26 |
| 7902682 | Ultraviolet energy curable tape and method of making a semiconductor chip using the tape | Donald W. Brouillette, Steven A. Martel, Matthew R. Whalen | 2011-03-08 |
| 7867876 | Method of thinning a semiconductor substrate | Steven R. Codding, Timothy E. Neary, Edmund J. Sprogis | 2011-01-11 |
| 7855130 | Corrosion inhibitor additives to prevent semiconductor device bond-pad corrosion during wafer dicing operations | Robert R Cadieux, Scott A. Estes | 2010-12-21 |
| 7844099 | Inspection method for protecting image sensor devices with front surface protection | Timothy E. Neary, Erik M. Probstfield | 2010-11-30 |
| 7771560 | Methods to prevent ECC (edge chipping and cracking) damage during die picking process | James Ryan Johnson, Matthew R. Whalen | 2010-08-10 |
| 7732303 | Method for recycling of ion implantation monitor wafers | Steven R. Codding, Joseph R. Greco | 2010-06-08 |
| 7722446 | System and device for thinning wafers that have contact bumps | Edmund J. Sprogis | 2010-05-25 |
| 7700488 | Recycling of ion implantation monitor wafers | Steven R. Codding, Joseph R. Greco | 2010-04-20 |
| 7666689 | Method to remove circuit patterns from a wafer | Steven R. Codding, David Domina, James L. Hardy | 2010-02-23 |
| 7572739 | Tape removal in semiconductor structure fabrication | Steven R. Codding, Steven G. Perrotte, Jason P. Ritter | 2009-08-11 |
| 7498236 | Silicon wafer thinning end point method | Steven R. Codding, Edmund J. Sprogis | 2009-03-03 |
| 7387911 | Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking | David M. Audette, Steven R. Codding, Brian J. Thibault, Matthew R. Whalen | 2008-06-17 |
| 7348216 | Rework process for removing residual UV adhesive from C4 wafer surfaces | Steven R. Codding, Edmund J. Sprogis, Jocelyn Sylvestre, Matthew R. Whalen | 2008-03-25 |
| 7288465 | Semiconductor wafer front side protection | Allan D. Abrams, Donald W. Brouillette, Joseph Danaher, Rene Lamothe, Ivan Stone +1 more | 2007-10-30 |
| 7135124 | Method for thinning wafers that have contact bumps | Edmund J. Sprogis | 2006-11-14 |
| 7074715 | Use of photoresist in substrate vias during backside grind | Donald W. Brouillette, Joseph Danaher, Amye L. Wells | 2006-07-11 |
| 7025891 | Method of polishing C4 molybdenum masks to remove molybdenum peaks | Steven R. Codding, Joseph Danaher, John C. Malinowski, James R. Palmer, Melvin T. Kelly +2 more | 2006-04-11 |
| 7001827 | Semiconductor wafer front side protection | Allan D. Abrams, Donald W. Brouillette, Joseph Danaher, Rene Lamothe, Ivan Stone +1 more | 2006-02-21 |