Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11715697 | Semiconductor packages including at least one supporting portion | Sungbum Kim, Jaewon Choi | 2023-08-01 |
| 10651074 | Substrate processing apparatus and method of manufacture using the same | Kyoung Hwan Kim, Byung-Lyul Park, Hyungjun Jeon | 2020-05-12 |
| 9922897 | Method of manufacturing semiconductor package | Kyoung Hwan Kim, Byung-Lyul Park, Hyungjun Jeon | 2018-03-20 |
| 9773685 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2017-09-26 |
| 9373573 | Solder joint flip chip interconnection | Rajendra D. Pendse, KyungOe Kim | 2016-06-21 |
| 8901734 | Semiconductor device and method of forming column interconnect structure to reduce wafer stress | SungWon Cho | 2014-12-02 |
| 8810029 | Solder joint flip chip interconnection | Rajendra D. Pendse, KyungOe Kim | 2014-08-19 |
| 8779570 | Stackable integrated circuit package system | Seong Bo Shim, Yong Hee Kang | 2014-07-15 |
| 8703541 | Electronic system with expansion feature | Haengcheol Choi, Ki Youn Jang, Il Kwon Shim | 2014-04-22 |
| RE44761 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2014-02-11 |
| RE44608 | Solder joint flip chip interconnection | Rajendra D. Pendse, KyungOe Kim | 2013-11-26 |
| RE44562 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2013-10-29 |
| 8216930 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2012-07-10 |
| 8211746 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Jong-Woo Ha, DongSoo Moon | 2012-07-03 |
| 8178392 | Electronic system with expansion feature | Haengcheol Choi, Ki Youn Jang, Il Kwon Shim | 2012-05-15 |
| 8173536 | Semiconductor device and method of forming column interconnect structure to reduce wafer stress | SungWon Cho | 2012-05-08 |
| 8129841 | Solder joint flip chip interconnection | Rajendra D. Pendse, KyungOe Kim | 2012-03-06 |
| 8018052 | Integrated circuit package system with side substrate having a top layer | KyungOe Kim, HyunSu Shin | 2011-09-13 |
| 7951643 | Integrated circuit packaging system with lead frame and method of manufacture thereof | Jong-Woo Ha, DongSoo Moon | 2011-05-31 |
| 7875495 | Standoff height improvement for bumping technology using solder resist | YoRim Lee, TaeKeun Lee | 2011-01-25 |
| 7659633 | Solder joint flip chip interconnection having relief structure | Rajendra D. Pendse, KyungOe Kim | 2010-02-09 |
| 7615865 | Standoff height improvement for bumping technology using solder resist | YoRim Lee, TaeKeun Lee | 2009-11-10 |