| 11309280 |
Semiconductor device package |
Yong Hoon Kim, Kil-Soo Kim, Kyung Suk Oh |
2022-04-19 |
| 10727199 |
Electronic device including semiconductor device package |
Yong Hoon Kim, Kil-Soo Kim, Kyung Suk Oh |
2020-07-28 |
| 10665575 |
Semiconductor package |
Eun-Seok Song, Chan-kyung Kim |
2020-05-26 |
| 10475774 |
Semiconductor package |
Eun-Seok Song, Chan-kyung Kim |
2019-11-12 |
| 10262967 |
Semiconductor packages |
Eun-Seok Song |
2019-04-16 |
| 10204885 |
Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers |
— |
2019-02-12 |
| 10020290 |
Semiconductor device having stacked semiconductor chips interconnected via TSV |
Yeong-Hwan Choe, Tae Hong Min, Young Kun Jee, Sang-Uk Han |
2018-07-10 |
| 9721926 |
Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same |
Yeong-Hwan Choe, Tae Hong Min, Young Kun Jee, Sang-Uk Han |
2017-08-01 |
| 9685400 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2017-06-20 |
| 9484292 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2016-11-01 |
| 8736035 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2014-05-27 |
| 8723315 |
Flip chip package |
Jong-Joo Lee, Cha-Jea Jo |
2014-05-13 |
| 8421244 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2013-04-16 |
| 8178969 |
Flip chip package |
Jong-Joo Lee, Cha-Jea Jo |
2012-05-15 |
| 8129221 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2012-03-06 |
| 8022555 |
Semiconductor package and method of forming the same |
Tae-Gyeong Chung, Eun-Chul Ahn |
2011-09-20 |
| 7821139 |
Flip-chip assembly and method of manufacturing the same |
Eun-Chul Ahn, Tae-Gyeong Chung |
2010-10-26 |
| 7612450 |
Semiconductor package including dummy board and method of fabricating the same |
Jong Gi LEE |
2009-11-03 |
| 7560374 |
Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold |
— |
2009-07-14 |
