Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400980 | Semiconductor package | Teak-Hoon Lee, Chajea Jo | 2025-08-26 |
| 12381185 | Semiconductor packages | Juhyeon Kim, Hyoeun Kim | 2025-08-05 |
| 12362344 | Semiconductor package and method of manufacturing the same | Juhyeon Kim, Hyoeun Kim | 2025-07-15 |
| 12087696 | Semiconductor package | Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han | 2024-09-10 |
| 12021073 | Semiconductor package and method of manufacturing the same | Juhyeon Kim, Hyoeun Kim | 2024-06-25 |
| 11948851 | Semiconductor package including high thermal conductivity layer | Sunjae Kim, Eunsil Kang, Daehyun Kim | 2024-04-02 |
| 11942446 | Semiconductor package and method of manufacturing the same | Hyoeun Kim, Seunghoon Yeon, Chajea Jo | 2024-03-26 |
| 11935873 | Methods of inspection of semiconductor packages including measurement of alignment accuracy among semiconductor chips | Joonho Jun, Un-Byoung Kang, Jongho Lee, Young Kun Jee | 2024-03-19 |
| 11923342 | Semiconductor package | Sanguk Han, Chajea Jo, Hyoeun Kim | 2024-03-05 |
| 11869818 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Seunghoon Yeon, Sanguk Han | 2024-01-09 |
| 11848293 | Semiconductor package | Teak-Hoon Lee, Chajea Jo | 2023-12-19 |
| 11776941 | Semiconductor package | Yonghoe Cho, Chajea Jo | 2023-10-03 |
| 11735566 | Semiconductor package | Ohguk KWON, Namhoon Kim, Hyoeun Kim | 2023-08-22 |
| 11710757 | Semiconductor package and method of fabricating the same | Ohguk KWON, Hyoeun Kim, Sang-Uk Han | 2023-07-25 |
| 11621250 | Semiconductor packages | Joonho Jun, Un-Byoung Kang, Jongho Lee, Young Kun Jee | 2023-04-04 |
| 11574873 | Semiconductor package | Taehwan Kim, Hyunjung Song, Hyoeun Kim, Wonil Lee, Sanguk Han | 2023-02-07 |
| 11482509 | Semiconductor package | Se-Ho You, Kyung Suk Oh | 2022-10-25 |
| 11444060 | Semiconductor package | Sanguk Han, Chajea Jo, Hyoeun Kim | 2022-09-13 |
| 11328966 | Chip-stacked semiconductor package and method of manufacturing same | Hyoeun Kim, Yonghoe Cho, Seunghoon Yeon, Sanguk Han | 2022-05-10 |
| 11222873 | Semiconductor packages including stacked substrates and penetration electrodes | Joonho Jun, Un-Byoung Kang, Jongho Lee, Young Kun Jee | 2022-01-11 |
| 10192855 | Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line | Chajea Jo, Ji Hwang Kim, Taeje Cho | 2019-01-29 |