SK

Sunjae Kim

Samsung: 6 patents #19,812 of 75,807Top 30%
LG: 5 patents #7,897 of 26,165Top 35%
MC Material Science Co.: 2 patents #23 of 75Top 35%
SC Stats Chippac: 2 patents #282 of 425Top 70%
Overall (All Time): #363,001 of 4,157,543Top 9%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12389545 Semiconductor packages having circuit boards KyongSoon Cho 2025-08-12
12349490 Sensor package and method of manufacturing the same 2025-07-01
12289985 Organic light-emitting device, apparatus including the same, and organometallic compound Myeongsuk Kim, Jimyoung Ye, Byeongwook Yoo, Illhun Cho, Sunwoo Kang +1 more 2025-04-29
12167685 Organic compounds and organic light emitting display device using the same Inbum SONG, Sangbeom Kim, Sunghoon Kim, Sang-Hoon Hong, Seong Min Park +3 more 2024-12-10
12035615 Organic light-emitting device, apparatus including the same, and organometallic compound Myeongsuk Kim, Byeongwook Yoo, Jimyoung Ye, Illhun Cho, Jaeho Jeong 2024-07-09
11948851 Semiconductor package including high thermal conductivity layer Eunsil Kang, Daehyun Kim, Sunkyoung Seo 2024-04-02
11844270 Compound and organic light emitting device including the same Heejun Park, Jeongdae Seo, Seonkeun Yoo, Soyoung Jang, Sunghoon Kim +6 more 2023-12-12
11744145 Organic compound and organic electroluminescent device comprising the same Inbum SONG, Seunghee Yoon, Heejun Park, Seonkeun Yoo, Soyoung Jang +5 more 2023-08-29
11545630 Compound and organic electroluminescent device comprising the same Inbum SONG, Seunghee Yoon, Sunghoon Kim, Tae Wan Lee, Dong Hun Lee +2 more 2023-01-03
10616155 Mobile terminal and method for controlling the same Huran Choi, Younhwa CHOI, Hyungtae Jang, Yoojin Choi, Sunghye Yoon 2020-04-07
9679846 Semiconductor device and method of forming conductive layer over substrate with vents to channel bump material and reduce interconnect voids Jaehyun Lee, JoongGi Kim 2017-06-13
8952529 Semiconductor device with conductive layer over substrate with vents to channel bump material and reduce interconnect voids Jaehyun Lee, JoongGi Kim 2015-02-10
8178236 Secondary battery including an insulation case with an insertion groove 2012-05-15