Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6497357 | Apparatus and method for removing interconnections | Raymond A. Jackson, Scott A. Bradley, Mario J. Interrante, David C. Linnell | 2002-12-24 |
| 6360938 | Process and apparatus to remove closely spaced chips on a multi-chip module | Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2002-03-26 |
| 6333563 | Electrical interconnection package and method thereof | Raymond A. Jackson, Anson J. Call, Mark G. Courtney, Mukta S. Farooq, Shaji Farooq +3 more | 2001-12-25 |
| 6300164 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2001-10-09 |
| 6297559 | Structure, materials, and applications of ball grid array interconnections | Anson J. Call, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2001-10-02 |
| 6216937 | Process and apparatus to remove closely spaced chips on a multi-chip module | Mario J. Interrante, Raymond A. Jackson, John U. Knickerbocker, Sudipta K. Ray, Kathleen A. Stalter | 2001-04-17 |
| 6120885 | Structure, materials, and methods for socketable ball grid | Anson J. Call, Shaji Farooq, Sung Kwon Kang, Sampath Purushothaman, Kathleen A. Stalter | 2000-09-19 |