Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9824999 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson | 2017-11-21 |
| 9305862 | Support mounted electrically interconnected die assembly | Marc E. Robinson, Lawrence Douglas Andrews, JR. | 2016-04-05 |
| 9252116 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Scott McGrath, Weiping Pan, De Ann Eileen Melcher, Marc E. Robinson | 2016-02-02 |
| 8912661 | Stacked die assembly having reduced stress electrical interconnects | Scott McGrath, Jeffrey S. Leal, Ravi Shenoy, Loreto Cantillep, Suzette K. Pangrle | 2014-12-16 |
| 8872318 | Through interposer wire bond using low CTE interposer with coarse slot apertures | Wael Zohni, Belgacem Haba | 2014-10-28 |
| 8847412 | Microelectronic assembly with thermally and electrically conductive underfill | Belgacem Haba | 2014-09-30 |
| 8742602 | Vertical electrical interconnect formed on support prior to die mount | Terrence Caskey, Lawrence Douglas Andrews, JR., Scott McGrath, Yong Du, Mark A. Scott | 2014-06-03 |
| 8723332 | Electrically interconnected stacked die assemblies | Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-05-13 |
| 8704379 | Semiconductor die mount by conformal die coating | Scott Jay Crane, Scott McGrath, Weiping Pan, DeAnn Eileen Melcher, Marc E. Robinson | 2014-04-22 |
| 8680687 | Electrical interconnect for die stacked in zig-zag configuration | Reynaldo Co, Grant Villavicencio, Jeffrey S. Leal | 2014-03-25 |
| 8629543 | Electrically interconnected stacked die assemblies | Lawrence Douglas Andrews, JR., Scott McGrath, Terrence Caskey, Scott Jay Crane, Marc E. Robinson +1 more | 2014-01-14 |
| 8324081 | Wafer level surface passivation of stackable integrated circuit chips | Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2012-12-04 |
| 8178978 | Support mounted electrically interconnected die assembly | Marc E. Robinson, Lawrence Douglas Andrews, JR. | 2012-05-15 |
| 8159053 | Flat leadless packages and stacked leadless package assemblies | Lawrence Douglas Andrews, JR., Jeffrey S. Leal | 2012-04-17 |
| 7923349 | Wafer level surface passivation of stackable integrated circuit chips | Terrence Caskey, Scott McGrath, DeAnn Eileen Melcher, Reynaldo Co, Lawrence Douglas Andrews, JR. +5 more | 2011-04-12 |
| 7843046 | Flat leadless packages and stacked leadless package assemblies | Lawrence Douglas Andrews, JR., Jeffrey S. Leal | 2010-11-30 |
| 6607939 | Method of making a multi-layer interconnect | Richard J. Pommer, Brad Banister | 2003-08-19 |
| 6388325 | Multi-layer interconnect | Richard J. Pommer, Brad Banister | 2002-05-14 |