Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10712508 | Fiber optic end-face transparent protector system and method | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Man W. Wong | 2020-07-14 |
| 10162124 | Fiber optic end-face transparent protector system and method | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Man W. Wong | 2018-12-25 |
| 9784924 | Fiber optic end-face transparent protector | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Man W. Wong | 2017-10-10 |
| 9465176 | Small form factor transceiver compatible with solder processing | Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan | 2016-10-11 |
| 9442255 | Low profile fiber-to-module interface with relaxed alignment tolerances | George F. Ahadian, Charles B. Kuznia, Richard T. Hagan | 2016-09-13 |
| 9429496 | Optical time domain reflectometer in a small form factor package | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan | 2016-08-30 |
| 9151916 | Compact optical package made with planar structures | Joseph F. Ahadian, Charles B. Kuznia, Richard T. Hagan | 2015-10-06 |
| 8724944 | Fiber optic bi-directional coupling lens | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan | 2014-05-13 |
| 8348522 | Attachable components for providing an optical interconnect between/through printed wiring boards | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan, Brian Catanzaro | 2013-01-08 |
| 8335411 | Fiber optic bi-directional coupling lens | Charles B. Kuznia, Joseph F. Ahadian, Richard T. Hagan | 2012-12-18 |
| 6910812 | Small-scale optoelectronic package | Charles B. Kuznia, Tri Le, Richard T. Hagen, Ronald E. Reedy, James S. Cable +2 more | 2005-06-28 |
| 6675456 | Alignment plate with matched thermal coefficient of expansion method | — | 2004-01-13 |
| 6673190 | Lasable bond-ply materials for high density printed wiring boards | David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Laura Miller +2 more | 2004-01-06 |
| 6607939 | Method of making a multi-layer interconnect | Simon J. S. McElrea, Brad Banister | 2003-08-19 |
| 6576839 | Bond-ply structure for interconnection of circuit layer pairs with conductive inks | Scott M. Zimmerman, Brad Banister | 2003-06-10 |
| 6570250 | Power conditioning substrate stiffener | — | 2003-05-27 |
| 6560844 | Alignment plate with matched thermal coefficient of expansion | — | 2003-05-13 |
| 6489184 | Removing inherent stress via high temperature annealing | Glen Roeters, Jim Yardley | 2002-12-03 |
| 6388325 | Multi-layer interconnect | Simon J. S. McElrea, Brad Banister | 2002-05-14 |
| 6338776 | Dielectric processing with included stabilization periods | — | 2002-01-15 |
| 6319811 | Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks | Scott M. Zimmerman, Brad Banister | 2001-11-20 |
| 6261423 | Sputtering process | Glen Roeters, Stephen M. Avery | 2001-07-17 |
| 6246014 | Printed circuit assembly and method of manufacture therefor | — | 2001-06-12 |
| 6245696 | Lasable bond-ply materials for high density printed wiring boards | David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Laura Miller +2 more | 2001-06-12 |
| 6242078 | High density printed circuit substrate and method of fabrication | Jeffrey T. Gotro, Nancy Androff, Marc Hein, Corey Zarecki | 2001-06-05 |