Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607939 | Method of making a multi-layer interconnect | Richard J. Pommer, Simon J. S. McElrea | 2003-08-19 |
| 6576839 | Bond-ply structure for interconnection of circuit layer pairs with conductive inks | Richard J. Pommer, Scott M. Zimmerman | 2003-06-10 |
| 6388325 | Multi-layer interconnect | Richard J. Pommer, Simon J. S. McElrea | 2002-05-14 |
| 6319811 | Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inks | Scott M. Zimmerman, Richard J. Pommer | 2001-11-20 |