Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6936537 | Methods for forming low-k dielectric films | Richard Hogle, Patrick J. Helly, Ce Ma | 2005-08-30 |
| 6673190 | Lasable bond-ply materials for high density printed wiring boards | David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Meifang Qin +2 more | 2004-01-06 |
| 6245696 | Lasable bond-ply materials for high density printed wiring boards | David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Meifang Qin +2 more | 2001-06-12 |