| 7193310 |
Stacking system and method |
Andrew Ross |
2007-03-20 |
| 7081373 |
CSP chip stack with flex circuit |
Andrew Ross |
2006-07-25 |
| 6878571 |
Panel stacking of BGA devices to form three-dimensional modules |
Harlan R. Isaak, Andrew Ross |
2005-04-12 |
| 6856010 |
Thin scale outline package |
John Patrick Sprint, Joel Andrew Mearig |
2005-02-15 |
| 6666810 |
Device for controllable stretching of thin materials |
Boris Moldavsky |
2003-12-23 |
| 6652659 |
Low species buffered rinsing fluids and method |
Raj Kumar |
2003-11-25 |
| 6573461 |
Retaining ring interconnect used for 3-D stacking |
Frank Mantz |
2003-06-03 |
| 6573460 |
Post in ring interconnect using for 3-D stacking |
Frank Mantz |
2003-06-03 |
| 6566746 |
Panel stacking of BGA devices to form three-dimensional modules |
Harlan R. Isaak, Andrew Ross |
2003-05-20 |
| 6489184 |
Removing inherent stress via high temperature annealing |
Richard J. Pommer, Jim Yardley |
2002-12-03 |
| 6431623 |
Vacuum device for peeling off thin sheets |
Boris Moldavsky |
2002-08-13 |
| 6261423 |
Sputtering process |
Richard J. Pommer, Stephen M. Avery |
2001-07-17 |
| 6153060 |
Sputtering process |
Richard J. Pommer, Stephen M. Avery |
2000-11-28 |