Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087997 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee +6 more | 2006-08-08 |
| 7037824 | Copper to aluminum interlayer interconnect using stud and via liner | Lloyd Burrell, Edward E. Cooney, III, Jeffrey P. Gambino, John E. Heidenreich, III, Hyun Koo Lee +6 more | 2006-05-02 |
| 6798066 | Heat dissipation from IC interconnects | William T. Motsiff, Timothy D. Sullivan, Jean Wynne | 2004-09-28 |
| 6650021 | Recessed bond pad | Anthony K. Stamper | 2003-11-18 |
| 6495917 | Method and structure of column interconnect | John J. Ellis-Monaghan, Paul M. Feeney, Robert M. Geffken, Howard S. Landis, Rosemary A. Previti-Kelly +3 more | 2002-12-17 |
| 6420254 | Recessed bond pad | Anthony K. Stamper | 2002-07-16 |
| 6362531 | Recessed bond pad | Anthony K. Stamper | 2002-03-26 |