Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9180541 | Rotational-flow spray nozzle and process of using same | Harikrishnan Ramanan, Nitin A. Deshpande | 2015-11-10 |
| 9142480 | Microelectronic package with high temperature thermal interface material | Daewoong Suh, Charles A. Hill | 2015-09-22 |
| 8987894 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | James Mellody | 2015-03-24 |
| 8765528 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | James Mellody | 2014-07-01 |
| 8390112 | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing | James Mellody | 2013-03-05 |
| 8308047 | Compliant spray flux masks, systems, and methods | Joel Williams, Sonny J. Randall, Steven B. Roach | 2012-11-13 |
| 8215536 | Rotational-flow spray nozzle and process of using same | Harikrishnan Ramanan, Nitin A. Deshpande | 2012-07-10 |
| 8067256 | Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method | James Mellody | 2011-11-29 |
| 8013439 | Injection molded metal stiffener for packaging applications | — | 2011-09-06 |
| 7996989 | Heat dissipating device with preselected designed interface for thermal interface materials | Ashay Dani, Christopher L. Rumer, Thomas J. Fitzgerald | 2011-08-16 |
| 7846778 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Saikumar Jayaraman, Paul A. Koning, Ashay Dani | 2010-12-07 |
| 7821126 | Heat sink with preattached thermal interface material and method of making same | Carl Deppisch | 2010-10-26 |
| 7723160 | Thermal interface structure with integrated liquid cooling and methods | James C. Matayabas, Jr. | 2010-05-25 |
| 7654433 | Flux overspray removal masks with channels, methods of assembling same, and systems containing same | Joel Williams | 2010-02-02 |
| 7644871 | Flux spray atomization and splash control | Harikrishnan Ramanan, Nitin A. Deshpande, Michael B. Colella, Nagaratnam Murugaiah | 2010-01-12 |
| 7629203 | Thermal interface material for combined reflow | Daewoong Suh, Edward A. Zarbock | 2009-12-08 |
| 7588968 | Linked chip attach and underfill | Edward A. Zarbock, Ming Lei | 2009-09-15 |
| 7534650 | Carbon-carbon and/or metal-carbon fiber composite heat spreader | Paul A. Koning, Greg M. Chrysler | 2009-05-19 |
| 7527090 | Heat dissipating device with preselected designed interface for thermal interface materials | Ashay Dani, Christopher L. Rumer, Thomas J. Fitzgerald | 2009-05-05 |
| 7473995 | Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly | Christopher L. Rumer, Saikumar Jayaraman, Paul A. Koning, Ashay Dani | 2009-01-06 |
| 7421780 | Methods for fabricating thermal management systems for micro-components | James C. Matayabas, Jr. | 2008-09-09 |
| 7416922 | Heat sink with preattached thermal interface material and method of making same | Carl Deppisch | 2008-08-26 |
| 7364943 | Method of bonding a microelectronic die to a substrate and arrangement to carry out method | James Mellody | 2008-04-29 |
| 7358606 | Apparatus to compensate for stress between heat spreader and thermal interface material | Christopher L. Rumer | 2008-04-15 |
| 7327027 | Thermal interface structure with integrated liquid cooling and methods | James C. Matayabas, Jr. | 2008-02-05 |