Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6528346 | Bump-forming method using two plates and electronic device | Masayuki Ochiai, Hidefumi Ueda, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2003-03-04 |
| 6025258 | Method for fabricating solder bumps by forming solder balls with a solder ball forming member | Masayuki Ochiai, Hidefumi Ueda, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +4 more | 2000-02-15 |
| 6022759 | Method for producing a semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake +5 more | 2000-02-08 |
| 5920117 | Semiconductor device and method of forming the device | Masashi Takenaka, Masanori Yoshimoto, Tsuyoshi Aoki, Ichiro Yamaguchi, Koki Otake | 1999-07-06 |
| 5861669 | Semiconductor package for surface mounting | Junichi Kasai, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1999-01-19 |
| 5831332 | Semiconductor package for surface mounting | Junichi Kasai, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1998-11-03 |
| 5804468 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ichiro Yamaguchi, Toshio Hamano +5 more | 1998-09-08 |
| 5801439 | Semiconductor device and semiconductor device unit for a stack arrangement | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kosuke Otokita +4 more | 1998-09-01 |
| 5786985 | Semiconductor device and semiconductor device unit | Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Masanori Yoshimoto, Katsuhiro Hayashida +5 more | 1998-07-28 |
| 5760471 | Semiconductor device having an inner lead extending over a central portion of a semiconductor device sealed in a plastic package and an outer lead exposed to the outside of a side face of the plastic package | Tetsuya Fujisawa, Mitsutaka Sato, Junichi Kasai, Masataka Mizukoshi, Kousuke Otokita +4 more | 1998-06-02 |
| 5747874 | Semiconductor device, base member for semiconductor device and semiconductor device unit | Masaaki Seki, Ichiro Yamaguchi, Kazuhiko Mitobe, Lim Cheang Hai, Koki Otake +5 more | 1998-05-05 |
| 5703398 | Semiconductor integrated circuit device and method of producing the semiconductor integrated circuit device | Kazuto Tsuji, Hideharu Sakoda, Yoshimi Suzuki, Masao Sakuma | 1997-12-30 |
| 5684675 | Semiconductor device unit having holder | Norio Taniguchi, Junichi Kasai, Kazuto Tsuji, Masanori Yoshimoto | 1997-11-04 |
| 5659200 | Semiconductor device having radiator structure | Kouji Saito, Masashi Takenaka, Masanori Yoshimoto | 1997-08-19 |
| 5643831 | Process for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor device | Masayuki Ochiai, Hidefumi Ueda, Ichiro Yamaguchi, Kazuhiko Mitobe, Koki Otake +6 more | 1997-07-01 |
| 5574310 | Semiconductor package for surface mounting with reinforcing members on support legs | Junichi Kasai, Masanori Yoshimoto, Kazuto Tsuji, Kouji Saito | 1996-11-12 |
| 5521432 | Semiconductor device having improved leads comprising palladium plated nickel | Kazuto Tsuji, Yoshiyuki Yoneda, Junichi Kasai | 1996-05-28 |
| 5497032 | Semiconductor device and lead frame therefore | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Ichiro Yamaguchi, Toshio Hamano +5 more | 1996-03-05 |
| 5451815 | Semiconductor device with surface mount package adapted for vertical mounting | Norio Taniguchi, Kazuto Tsuji, Junichi Kasai | 1995-09-19 |
| 5444025 | Process for encapsulating a semiconductor package having a heat sink using a jig | Kouji Saito, Masashi Takenaka, Masanori Yoshimoto | 1995-08-22 |
| 5424251 | Method of producing semiconductor device having radiation part made of resin containing insulator powders | Junichi Kasai | 1995-06-13 |
| 5361970 | Method of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leads | Junichi Kasai, Tosiyuki Honda | 1994-11-08 |
| 5343615 | Semiconductor device and a process for making same having improved leads | Akihiro Kubota, Junichi Kasai, Masanori Yoshimoto, Keiichi Masaki | 1994-09-06 |
| 5309016 | Semiconductor integrated circuit device having terminal members provided between semiconductor element and leads | Junichi Kasai, Tosiyuki Honda | 1994-05-03 |
| 5305179 | Surface-mounting type semiconductor package having an improved efficiency for heat dissipation | Junichi Kasai, Kouji Saito, Kazuhiko Mitobe, Masanori Yoshimoto | 1994-04-19 |