| 8883610 |
Microstructure device including a metallization structure with self-aligned air gaps between closely spaced metal lines |
Robert Seidel, Axel Preusse |
2014-11-11 |
| 8389401 |
Contact elements of semiconductor devices formed on the basis of a partially applied activation layer |
Robert Seidel, Axel Preusse |
2013-03-05 |
| 8323471 |
Automatic deposition profile targeting |
Thomas Ortleb, Dirk Wollstein |
2012-12-04 |
| 8314494 |
Metal cap layer of increased electrode potential for copper-based metal regions in semiconductor devices |
Axel Preusse, Robert Seidel |
2012-11-20 |
| 7947158 |
Apparatus and method for removing bubbles from a process liquid |
Helge Hartz, Axel Preusse |
2011-05-24 |
| 7899570 |
Advanced automatic deposition profile targeting and control by applying advanced polish endpoint system feedback |
Thomas Ortleb, Thomas Harold Roessler |
2011-03-01 |
| 7781329 |
Reducing leakage in dielectric materials including metal regions including a metal cap layer in semiconductor devices |
Axel Preusse, Thomas Ortleb, Juergen Boemmels |
2010-08-24 |
| 7781343 |
Semiconductor substrate having a protection layer at the substrate back side |
Tobias Letz, Holger Schuehrer |
2010-08-24 |
| 7615103 |
Apparatus and method for removing bubbles from a process liquid |
Helge Hartz, Axel Preusse |
2009-11-10 |
| 7560381 |
Technique for metal deposition by electroless plating using an activation scheme including a substrate heating process |
Axel Preusse, Matthias Bonkass |
2009-07-14 |
| 7517782 |
Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase |
Axel Preusse, Susanne Wehner |
2009-04-14 |
| 7476552 |
Method of reworking a semiconductor structure |
Axel Preusse, Uwe Stoeckgen |
2009-01-13 |
| 7169664 |
Method of reducing wafer contamination by removing under-metal layers at the wafer edge |
Axel Preusse, Holger Schührer |
2007-01-30 |
| 6958247 |
Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process |
Gerd Marxsen, Axel Preusse, Frank Mauersberger |
2005-10-25 |
| 6951816 |
Method of forming a metal layer over patterned dielectric by electroless deposition using a catalyst |
Axel Preusse |
2005-10-04 |
| 6620726 |
Method of forming metal lines having improved uniformity on a substrate |
Axel Preusse, Gerd Marxsen |
2003-09-16 |
