Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806006 | Etch isolation LPCC/QFN strip | Tung Lok Li, Kwok Cheung Tsang | 2017-10-31 |
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2016-12-13 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Geraldine Tsui Yee Lin, Walter de Munnik, Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan +1 more | 2012-12-11 |
| 7449771 | Multiple leadframe laminated IC package | Chun Ho Fan, Tsui Yee Lin, Shui Ming Tse, Wing Him Lau, Shuk Man Wong | 2008-11-11 |
| 7358119 | Thin array plastic package without die attach pad and process for fabricating the same | Neil McLellan, Serafin P. Pedron, Jr., Leo M. Higgins, III, Kwok Cheung Tsang | 2008-04-15 |
| 7270867 | Leadless plastic chip carrier | Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan | 2007-09-18 |
| 7271032 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Wing Him Lau | 2007-09-18 |
| 7232755 | Process for fabricating pad frame and integrated circuit package | Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang | 2007-06-19 |
| 7226811 | Process for fabricating a leadless plastic chip carrier | Neil McLellan, Chun Ho Fan, Wing Him Lau | 2007-06-05 |
| 7081403 | Thin leadless plastic chip carrier | Mohan Kirloskar, Chun Ho Fan, Kwok Cheung Tsang | 2006-07-25 |
| 7009286 | Thin leadless plastic chip carrier | Mohan Kirloskar, Chun Ho Fan, Kwok Cheung Tsang | 2006-03-07 |
| 6995460 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Wing Him Lau | 2006-02-07 |
| 6989294 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Wing Him Lau | 2006-01-24 |
| 6946324 | Process for fabricating a leadless plastic chip carrier | Neil McLellan, Chun Ho Fan, Wing Him Lau | 2005-09-20 |
| 6933594 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Chun Ho Fan, Kwok Cheung Tsang, Wing Him Lau | 2005-08-23 |
| 6872661 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan | 2005-03-29 |
| 6734044 | Multiple leadframe laminated IC package | Chun Ho Fan, Tsui Yee Lin, Shui Ming Tse, Wing Him Lau, Shuk Man Wong | 2004-05-11 |
| 6635957 | Leadless plastic chip carrier with etch back pad singulation and die attach pad array | Wing Him Lau, Kwok Cheung Tsang, Chun Ho Fan, Neil McLellan | 2003-10-21 |