Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154840 | Semiconductor device and semiconductor package having the same | Seonho Lee, Jinsu Kim, Yongjin Park, Jaekul Lee | 2024-11-26 |
| 11670568 | Semiconductor device and semiconductor package having the same | Seonho Lee, Jinsu Kim, Yongjin Park, Jaekul Lee | 2023-06-06 |
| 11088060 | Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package | Jaekul Lee, Jinseon Park | 2021-08-10 |
| 10573600 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | HeeJo Chi, NamJu Cho | 2020-02-25 |
| 9735113 | Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP | HeeJo Chi, NamJu Cho | 2017-08-15 |
| 8937372 | Integrated circuit package system with molded strip protrusion | Jae Hak Yee | 2015-01-20 |
| 8810019 | Integrated circuit package system with stacked die | Jae Hak Yee, Byoung Wook Jang | 2014-08-19 |
| 8710634 | Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereof | HeeJo Chi, Jae Han Chung, Yeonglm Park, HyungMin Lee | 2014-04-29 |
| 8501540 | Method for manufacture of inline integrated circuit system | Jae Hak Yee, Byoung Wook Jang, YoungChul Kim | 2013-08-06 |
| 8421210 | Integrated circuit packaging system with dual side connection and method of manufacture thereof | HeeJo Chi, Soo Jung Park | 2013-04-16 |
| 8304296 | Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof | ChanHoon Ko, WonIl Kwon | 2012-11-06 |
| 8183089 | Method for manufacturing package system incorporating flip-chip assembly | A Leam Choi, Young Jin Woo | 2012-05-22 |
| 8138591 | Integrated circuit package system with stacked die | Jae Hak Yee, Byoung Wook Jang | 2012-03-20 |
| 7968981 | Inline integrated circuit system | Jae Hak Yee, Byoung Wook Jang, YoungChul Kim | 2011-06-28 |
| 7871861 | Stacked integrated circuit package system with intra-stack encapsulation | Sungmin Song, Byoung Wook Jang | 2011-01-18 |
| 7859120 | Package system incorporating a flip-chip assembly | A Leam Choi, Young Jin Woo | 2010-12-28 |