Issued Patents All Time
Showing 1–25 of 54 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12388032 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Doo Hyun Park, Choon Heung Lee | 2025-08-12 |
| 12237239 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2025-02-25 |
| 12176443 | Electronic sensor devices and methods of manufacturing electronic sensor devices | Sung Hwan Yang, Jae Ho Lee | 2024-12-24 |
| 12107035 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2024-10-01 |
| 12033946 | Semiconductor devices and methods of manufacturing semiconductor devices | Seung Chul Jang, Ron Huemoeller | 2024-07-09 |
| 12002725 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2024-06-04 |
| 11990435 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2024-05-21 |
| 11961794 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2024-04-16 |
| 11908779 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2024-02-20 |
| 11682598 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2023-06-20 |
| 11600582 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Doo Hyun Park, Choon Heung Lee | 2023-03-07 |
| 11594512 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Kwangmo Chris Lim | 2023-02-28 |
| 11437526 | Electronic devices having a sensor and a translucent mold compound and methods of manufacturing electronic devices | Sung Hwan Yang, Jae Ho Lee | 2022-09-06 |
| 11430723 | Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrate | Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park +4 more | 2022-08-30 |
| 11393734 | Fingerprint sensor and manufacturing method thereof | Sung-Sun Park, Christopher J. Berry | 2022-07-19 |
| 11342276 | Semiconductor device and method of manufacturing semiconductor device | Jae Ho Lee, Byong Il HEO | 2022-05-24 |
| 11342268 | Semiconductor devices and methods of manufacturing semiconductor devices | Seung Chul Jang, Ron Huemoeller | 2022-05-24 |
| 11205602 | Semiconductor device and manufacturing method thereof | Jin Young Khim, Ju Hoon Yoon, Kwang Woong Ahn, Ho Jeong Lim, Tae Yong Lee +1 more | 2021-12-21 |
| 11177187 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2021-11-16 |
| D932627 | Mandibular advancement device for anti snoring | — | 2021-10-05 |
| 11018079 | Land structure for semiconductor package and method therefor | Kyoung Yeon Lee, Byong Jin Kim, Jae Min Bae, Hyung Il Jeon, Gi Jeong Kim | 2021-05-25 |
| 10943884 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Kwangmo Chris Lim | 2021-03-09 |
| 10910298 | Method of forming a molded substrate electronic package and structure | Won Bae Bang, Byong Jin Kim, Gi Jeong Kim | 2021-02-02 |
| 10707181 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Doo Hyun Park, Choon Heung Lee | 2020-07-07 |
| 10672676 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2020-06-02 |