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Hybrid scanning electron microscopy and acousto-optic based metrology |
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| 11859963 |
Depth profiling of semiconductor structures using picosecond ultrasonics |
Ori Golani |
2024-01-02 |
| 11815470 |
Multi-perspective wafer analysis |
Haim Feldman, Eyal NEISTEIN, Harel Ilan, Shahar Arad, Ori Golani |
2023-11-14 |
| 11803961 |
Die-to-multi-die wafer inspection |
Ron Naftali, Yariv Simovitch, Guy Shwartz |
2023-10-31 |
| 11713964 |
Cathodoluminescence focal scans to characterize 3D NAND CH profile |
David Goldovsky, Ronny Barnea |
2023-08-01 |
| 11688055 |
Methods and systems for analysis of wafer scan data |
Guy Shwartz |
2023-06-27 |
| 11662324 |
Three-dimensional surface metrology of wafers |
Ron Bar-Or, Lior Yaron |
2023-05-30 |
| 11519720 |
Depth profiling of semiconductor structures using picosecond ultrasonics |
Ori Golani |
2022-12-06 |
| 11250560 |
Methods and systems for expediting multi-perspective wafer analysis |
Doron Korngut |
2022-02-15 |
| 11195267 |
Multi-perspective wafer analysis using an acousto-optic deflector |
Harel Ilan, Doron Korngut, Ori Golani |
2021-12-07 |
| 11035803 |
Multi-perspective examination of a specimen |
Ori Golani |
2021-06-15 |
| 10902582 |
Computerized system and method for obtaining information about a region of an object |
Haim Feldman, Eyal NEISTEIN, Harel Ilan, Shahar Arad |
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| 9784689 |
Method and system for inspecting an object with an array of beams |
Ron Naftali |
2017-10-10 |
| 9535014 |
Systems and methods for inspecting an object |
Haim Feldman, Ido Dolev |
2017-01-03 |
