| 12198982 |
Laser dicing for singulation |
Michael Todd Wyant, Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi |
2025-01-14 |
| 11664276 |
Front side laser-based wafer dicing |
Matthew John Sherbin, Michael Todd Wyant, Christopher Daniel Manack, Hiroyuki Sada, Shoichi Iriguchi +2 more |
2023-05-30 |
| 11498831 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2022-11-15 |
| 11482442 |
Subring for semiconductor dies |
Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Sada Hiroyuki, Shoichi Iriguchi |
2022-10-25 |
| 11469141 |
Laser dicing for singulation |
Michael Todd Wyant, Dave Charles Stepniak, Matthew John Sherbin, Sada Hiroyuki, Shoichi Iriguchi |
2022-10-11 |
| 11367699 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2022-06-21 |
| 11171031 |
Die matrix expander with partitioned subring |
Matthew John Sherbin, Michael Todd Wyant, Dave Charles Stepniak, Hiroyuki Sada, Shoichi Iriguchi |
2021-11-09 |
| 10763230 |
Integrated circuit backside metallization |
Hiroyuki Sada, Shoichi Iriguchi, Luu Thanh Nguyen, Ashok S. Prabhu, Anindya Poddar +2 more |
2020-09-01 |
| 10723616 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2020-07-28 |
| 10658240 |
Semiconductor die singulation |
Shoichi Iriguchi, Hiroyuki Sada |
2020-05-19 |
| 10233074 |
Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2019-03-19 |
| 9896330 |
Structure and method for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip |
Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more |
2018-02-20 |
| 9543206 |
Wafer die separation |
— |
2017-01-10 |
| 9230862 |
Wafer die separation |
— |
2016-01-05 |