Issued Patents All Time
Showing 25 most recent of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652084 | Flat lead package formation method | Thorsten Meyer, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Stephan Bradl, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |
| 10903166 | Integrated circuit packages | Sanka Ganesan, Thorsten Meyer | 2021-01-26 |
| 10707158 | Package with vertical interconnect between carrier and clip | Alexander Heinrich, Bernd Goller, Thorsten Meyer | 2020-07-07 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Peter Scherl, Stephan Bradl, Stefan Miethaner, Alexander Heinrich +1 more | 2020-02-18 |
| 10522454 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Andreas Wolter, Georg Seidemann, Sven Albers, Christian Geissler | 2019-12-31 |
| 10301176 | Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) | Thorsten Meyer, Reinhard Mahnkopf, Christian Geissler, Andreas Augustin | 2019-05-28 |
| 10228725 | Flexible band wearable electronic device | Sven Albers, Klaus Reingruber, Andreas Wolter, Georg Seidemann, Christian Geissler +1 more | 2019-03-12 |
| 10211182 | Package-on-package stacked microelectronic structures | Thorsten Meyer | 2019-02-19 |
| 10157869 | Integrated circuit package | Thorsten Meyer, Teodora Ossiander, Frank Zudock, Christian Geissler | 2018-12-18 |
| 10150668 | Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) | Thorsten Meyer, Reinhard Mahnkopf, Christian Geissler, Andreas Augustin | 2018-12-11 |
| 9997444 | Microelectronic package having a passive microelectronic device disposed within a package body | Thorsten Meyer, Andreas Wolter, Georg Seidemann, Sven Albers, Christian Geissler | 2018-06-12 |
| 9888577 | Passive electrical devices with a polymer carrier | Thorsten Meyer, Sven Albers, Reinhard Mahnkopf | 2018-02-06 |
| 9856136 | Chip arrangement and method for manufacturing a chip arrangement | Thorsten Meyer, Christian Mueller, Reinhard Mahnkopf, Christian Geissler, Andreas Augustin | 2018-01-02 |
| 9663353 | Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC) | Thorsten Meyer, Reinhard Mahnkopf, Christian Geissler, Andreas Augustin | 2017-05-30 |
| 9550670 | Stress buffer layer for integrated microelectromechanical systems (MEMS) | Christian Geissler, Thorsten Meyer, Reinhard Mahnkopf, Andreas Augustin, Christian Mueller | 2017-01-24 |
| 9543224 | Hybrid exposure for semiconductor devices | Thorsten Meyer, Robert L. Sankman | 2017-01-10 |
| 9472515 | Integrated circuit package | Thorsten Meyer, Teodora Ossiander, Frank Zudock, Christian Geissler | 2016-10-18 |
| 9385105 | Semiconductor devices | Thorsten Meyer, Bernd Waidhas, Hans-Joachim Barth, Sven Albers, Reinhard Golly +2 more | 2016-07-05 |
| 9263376 | Chip interposer, semiconductor device, and method for manufacturing a semiconductor device | Thorsten Meyer | 2016-02-16 |
| 9056763 | Stress buffer layer for integrated microelectromechanical systems (MEMS) | Christian Geissler, Thorsten Meyer, Reinhard Mahnkopf, Andreas Augustin, Christian Mueller | 2015-06-16 |
| 9059304 | Enhanced flip chip package | Thorsten Meyer, Bernd Waidhas | 2015-06-16 |
| 8878360 | Stacked fan-out semiconductor chip | Thorsten Meyer, Sven Albers | 2014-11-04 |
| 8754522 | Repairable semiconductor device and method | Thorsten Meyer | 2014-06-17 |
| 8741690 | Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads | Thorsten Meyer, Rainer Leuschner, Reinhard Hess, Recai Sezi | 2014-06-03 |