| 11978661 |
Ultralow-K dielectric-gap wrapped contacts and method |
Fuad H. Al-Amoody, Spencer H. Porter, Mark D. Levy, Siva P. Adusumilli |
2024-05-07 |
| 10163697 |
Method for forming BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion |
Edward C. Cooney, III, Michael S. Dusablon, David C. Mosher |
2018-12-25 |
| 9673091 |
Structure for BEOL metal levels with multiple dielectric layers for improved dielectric to metal adhesion |
Edward C. Cooney, III, Michael S. Dusablon, David C. Mosher |
2017-06-06 |
| 9284185 |
Integrated circuit switches, design structure and methods of fabricating the same |
Thomas L. McDevitt, Anthony K. Stamper, Julio C. Costa, Jonathan Hale Hammond |
2016-03-15 |
| 9275951 |
Curvilinear wiring structure to reduce areas of high field density in an integrated circuit |
Thomas L. McDevitt, Anthony K. Stamper |
2016-03-01 |
| 8975531 |
Composite copper wire interconnect structures and methods of forming |
Zhong-Xiang He, Anthony K. Stamper |
2015-03-10 |
| 8969195 |
Methods of manufacturing semiconductor devices and a semiconductor structure |
Steven P. Barkyoumb, Edward C. Cooney, III, Thomas L. McDevitt, William J. Murphy, David C. Strippe |
2015-03-03 |
| 8927411 |
System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more |
2015-01-06 |
| 8921975 |
System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more |
2014-12-30 |
| 8878315 |
Horizontal coplanar switches and methods of manufacture |
Thomas L. McDevitt, Anthony K. Stamper |
2014-11-04 |
| 8791778 |
Vertical integrated circuit switches, design structure and methods of fabricating same |
Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper |
2014-07-29 |
| 8604898 |
Vertical integrated circuit switches, design structure and methods of fabricating same |
Edward C. Cooney, III, Thomas L. McDevitt, Anthony K. Stamper |
2013-12-10 |
| 8569091 |
Integrated circuit switches, design structure and methods of fabricating the same |
Thomas L. McDevitt, Anthony K. Stamper |
2013-10-29 |
| 8535966 |
Horizontal coplanar switches and methods of manufacture |
Thomas L. McDevitt, Anthony K. Stamper |
2013-09-17 |
| 8530970 |
Curvilinear wiring structure to reduce areas of high field density in an integrated circuit |
Thomas L. McDevitt, Anthony K. Stamper |
2013-09-10 |
| 8518817 |
Method of electrolytic plating and semiconductor device fabrication |
Zhong-Xiang He, Anthony K. Stamper, Eric J. White |
2013-08-27 |
| 8293634 |
Structures and methods for improving solder bump connections in semiconductor devices |
William J. Cote, Daniel C. Edelstein, Thomas L. McDevitt, Anthony K. Stamper |
2012-10-23 |
| 8137791 |
Fuse and pad stress relief |
Jeffrey P. Gambino, Thomas L. McDevitt, Anthony K. Stamper |
2012-03-20 |
| 8129844 |
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices |
Zhong-Xiang He, Thomas L. McDevitt, Eric J. White |
2012-03-06 |
| 7851353 |
Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices |
Zhong-Xiang He, Thomas Leddy McDevin, Eric J. White |
2010-12-14 |
| 7833907 |
CMP methods avoiding edge erosion and related wafer |
Anthony K. Stamper |
2010-11-16 |
| 7538006 |
Annular damascene vertical natural capacitor |
Thomas L. McDevitt, Anthony K. Stamper |
2009-05-26 |
