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Method and wet chemical compositions for diffusion barrier formation |
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Method for enhancing the solderability of a surface |
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Adhesion promotion in printed circuit boards |
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2015-05-26 |
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Method for enhancing the solderability of a surface |
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Adhesion promotion in printed circuit boards |
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2012-03-27 |
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Adhesion promotion in printed circuit boards |
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| 7393781 |
Capping of metal interconnects in integrated circuit electronic devices |
Richard Hurtubise, Christian Witt, Qingyun Chen |
2008-07-01 |
| 7332193 |
Cobalt and nickel electroless plating in microelectronic devices |
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2008-02-19 |
| 7268074 |
Capping of metal interconnects in integrated circuit electronic devices |
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| 7232478 |
Adhesion promotion in printed circuit boards |
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— |
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Cathodic photoresist stripping process |
— |
2002-08-20 |
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Method for enhancing the solderability of a surface |
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Process for preparing a non-conductive substrate for electroplating |
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1998-06-02 |
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Method for enhancing the solderability of a surface |
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Process for preparing a non-conductive substrate for electroplating |
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Process for preparing a non-conductive substrate for electroplating |
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| 5468515 |
Composition and method for selective plating |
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