Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE45881 | Method for enhancing the solderability of a surface | Ronald Redline, David Sawoska, Peter Kukanskis, Eric Yakobson | 2016-02-09 |
| RE45842 | Method for enhancing the solderability of a surface | Ronald Redline, David Sawoska, Peter Kukanskis, Eric Yakobson | 2016-01-12 |
| RE45297 | Method for enhancing the solderability of a surface | Ronald Redline, David Sawoska, Peter Kukanskis, Eric Yakobson | 2014-12-23 |
| 7186305 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2007-03-06 |
| 6554948 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2003-04-29 |
| 6503566 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2003-01-07 |
| 6419784 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2002-07-16 |
| 6383272 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2002-05-07 |
| 6162503 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 2000-12-19 |
| 6146701 | Process for improving the adhension of polymeric materials to metal surfaces | — | 2000-11-14 |
| 6020029 | Process for treating metal surfaces | Frank Durso | 2000-02-01 |
| 5935640 | Method for enhancing the solderability of a surface | Eric Yakobson | 1999-08-10 |
| 5869130 | Process for improving the adhesion of polymeric materials to metal surfaces | — | 1999-02-09 |
| 5843517 | Composition and method for selective plating | Donna M. Kologe, Gary B. Larson | 1998-12-01 |
| 5759378 | Process for preparing a non-conductive substrate for electroplating | Rosa Martinez, Eric Yakobson | 1998-06-02 |
| 5733599 | Method for enhancing the solderability of a surface | Eric Yakobson | 1998-03-31 |
| 5632927 | Process for preparing a non-conductive substrate for electroplating | Rosa Martinez, Eric Yakobson | 1997-05-27 |
| 5536386 | Process for preparing a non-conductive substrate for electroplating | Rosa Martinez, Eric Yakobson | 1996-07-16 |
| 5518760 | Composition and method for selective plating | Eric Yakobson | 1996-05-21 |
| 5468515 | Composition and method for selective plating | Eric Yakobson | 1995-11-21 |
| 5334240 | Aqueous acidic tin-lead immersion plating bath containing weak acid and weak base | — | 1994-08-02 |
| 5289630 | Process for fabricating multilayer printed circuits | Donald P. Cullen, Edward Donlon, Gary B. Larson, William J. Decesare, John L. Cordani | 1994-03-01 |
| 5261154 | Process for fabricating multilayer printed circuits | Donald P. Cullen, Edward Donlon, Gary B. Larson, William J. Decesare, John L. Cordani +1 more | 1993-11-16 |
| 5104688 | Pretreatment composition and process for tin-lead immersion plating | Barry H. Williams | 1992-04-14 |
| 4976990 | Process for metallizing non-conductive substrates | Wolf Bach, Peter Kukanskis, Ann S. Williams, Mary J. Senechal | 1990-12-11 |