Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10818582 | Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture | Aira Lourdes Villamor, Geraldine Suico, Silnore Tejero SABANDO | 2020-10-27 |
| 10483192 | Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture | Aira Lourdes Villamor, Geraldine Suico, Silnore Tejero SABANDO | 2019-11-19 |
| 9978668 | Packaged semiconductor devices with laser grooved wettable flank and methods of manufacture | Aira Lourdes Villamor, Geraldine Suico, Silnore Tejero SABANDO | 2018-05-22 |
| 8513059 | Pre-molded clip structure | Maria Cristina Estacio | 2013-08-20 |
| 8497164 | Semiconductor die package and method for making the same | Armand Vincent C. Jereza, Paul Armand Asentista Calo | 2013-07-30 |
| 8222718 | Semiconductor die package and method for making the same | Armand Vincent C. Jereza, Paul Armand Asentista Calo | 2012-07-17 |
| 8058107 | Semiconductor die package using leadframe and clip and method of manufacturing | Elsie Agdon Cabahug, Ti Ching Shian, Venkat Iyer | 2011-11-15 |
| 8008759 | Pre-molded clip structure | Maria Cristina Estacio | 2011-08-30 |
| 7972906 | Semiconductor die package including exposed connections | Maria Cristina Estacio | 2011-07-05 |
| 7932171 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Margie T. Rios | 2011-04-26 |
| 7838340 | Pre-molded clip structure | Maria Cristina Estacio | 2010-11-23 |
| 7768105 | Pre-molded clip structure | Maria Cristina Estacio | 2010-08-03 |
| 7501337 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Margie T. Rios | 2009-03-10 |
| 7402462 | Folded frame carrier for MOSFET BGA | Ruben Madrid, Marvin Gestole, Romel N. Madatad, Arniel Jaud, Paul Armand Asentista Calo | 2008-07-22 |
| 7285849 | Semiconductor die package using leadframe and clip and method of manufacturing | Elsie Agdon Cabahug, Ti Ching Shian, Venkat Iyer | 2007-10-23 |
| 7271497 | Dual metal stud bumping for flip chip applications | Rajeev Joshi, Consuelo Tangpuz, Margie T. Rios | 2007-09-18 |
| 6943434 | Method for maintaining solder thickness in flipchip attach packaging processes | Consuelo Tangpuz, Romel N. Manatad, Margie T. Rios | 2005-09-13 |
| 6731003 | Wafer-level coated copper stud bumps | Rajeev Joshi, Consuelo Tangpuz | 2004-05-04 |