DN

Dong Niu

NS Novellus Systems: 13 patents #64 of 780Top 9%
FC Fu Ding Electronical Technology (Jiashan) Co.: 1 patents #35 of 100Top 35%
Foxconn: 1 patents #3,106 of 5,504Top 60%
Lam Research: 1 patents #1,364 of 2,128Top 65%
Overall (All Time): #305,051 of 4,157,543Top 8%
15
Patents All Time

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12385138 Plasma-enhanced deposition of film stacks Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Keith Fox, John B. Alexy +5 more 2025-08-12
12217985 Wafer placement correction in indexed multi-station processing chambers Stephen Topping 2025-02-04
11746420 PECVD apparatus for in-situ deposition of film stacks Pramod Subramonium, Joseph L. Womack, Keith Fox 2023-09-05
10214816 PECVD apparatus for in-situ deposition of film stacks Jason Dirk Haverkamp, Pramod Subramonium, Joseph L. Womack, Keith Fox, John B. Alexy +5 more 2019-02-26
9370812 Reshaping device and positioning assembly thereof Wei-Zhong Dai 2016-06-21
9165788 Post-deposition soft annealing Keith Fox, Bart J. van Schravendijk, Lucas Benjamin HENDERSON, Joseph L. Womack 2015-10-20
9028924 In-situ deposition of film stacks Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Keith Fox, John B. Alexy +5 more 2015-05-12
8895415 Tensile stressed doped amorphous silicon Keith Fox, Joseph L. Womack 2014-11-25
8741394 In-situ deposition of film stacks Jason Dirk Haverkamp, Pramod Subramonium, Joe Womack, Keith Fox, John B. Alexy +5 more 2014-06-03
8709551 Smooth silicon-containing films Keith Fox, Joe Womack, Mandyam Sriram, George Andrew Antonelli, Bart J. van Schravendijk +1 more 2014-04-29
7781351 Methods for producing low-k carbon doped oxide films with low residual stress Qingguo Wu, Haiying Fu, Ananda K. Bandyopadhyay, David Mordo 2010-08-24
7390537 Methods for producing low-k CDO films with low residual stress Qingguo Wu, Haiying Fu 2008-06-24
7381662 Methods for improving the cracking resistance of low-k dielectric materials Haiying Fu, Brian Lu, Feng Wang 2008-06-03
7326444 Methods for improving integration performance of low stress CDO films Qingguo Wu, Honghong Wang, Haiying Fu 2008-02-05
7094713 Methods for improving the cracking resistance of low-k dielectric materials Haiying Fu, Brian Lu, Feng Wang 2006-08-22