| 12421103 |
Microelectromechanical system device |
Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen |
2025-09-23 |
| 11577954 |
Method for forming semiconductor device |
Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen |
2023-02-14 |
| 11206493 |
Sensor device and manufacturing method thereof |
Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen |
2021-12-21 |
| 11186481 |
Sensor device and manufacturing method thereof |
Chun-Wen Cheng, Jiou-Kang Lee |
2021-11-30 |
| 10865099 |
MEMS device and method for forming the same |
Chun-Wen Cheng, Chia-Hua Chu, En-Chan Chen |
2020-12-15 |
| 10087071 |
Semiconductor structure and manufacturing method thereof |
Tzu-Heng Wu, Chia-Hua Chu, Yi Heng Tsai, Cheng San Chou |
2018-10-02 |
| 9550667 |
Semiconductor structure and manufacturing method thereof |
Cheng San Chou, Chin-Min Lin |
2017-01-24 |
| 7582511 |
Method for wafer level chip scale packaging with passive components integrated into packaging structure |
— |
2009-09-01 |
| 7566574 |
Method of performing a double-sided process |
— |
2009-07-28 |
| 7531457 |
Method of fabricating suspended structure |
Yu-Fu Kang |
2009-05-12 |
| 7505118 |
Wafer carrier |
— |
2009-03-17 |
| 7465601 |
Method of forming suspended structure |
Yu-Fu Kang |
2008-12-16 |
| 7410835 |
Method for fabricating semiconductor package with short-prevented lead frame |
Jui-Hsiang Hung, Chin-Teng Hsu, Chih-Jen Yang |
2008-08-12 |
| 7306955 |
Method of performing a double-sided process |
— |
2007-12-11 |
| 7297610 |
Method of segmenting a wafer |
— |
2007-11-20 |
| 7256128 |
Method of double-sided etching |
— |
2007-08-14 |
| 7192842 |
Method for bonding wafers |
Shih-Feng Shao, Hsin-Ya Peng |
2007-03-20 |
| 7045463 |
Method of etching cavities having different aspect ratios |
— |
2006-05-16 |
| 7008821 |
Method of forming a wafer backside interconnecting wire |
Shih-Feng Shao, Hsin-Ya Peng |
2006-03-07 |
