Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10115579 | Method for manufacturing wafer-level semiconductor packages | Teng Hock Kuah | 2018-10-30 |
| 10014187 | Cavity package with pre-molded substrate | — | 2018-07-03 |
| 9887149 | Cavity package with die attach pad | — | 2018-02-06 |
| 9659855 | Cavity package with pre-molded substrate | — | 2017-05-23 |
| 9601413 | Cavity package with die attach pad | — | 2017-03-21 |
| 9536812 | Cavity package with pre-molded cavity leadframe | — | 2017-01-03 |
| 9520306 | Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2016-12-13 |
| 9484241 | Device for holding multiple semiconductor devices during thermocompression bonding and method of bonding | Man Chan | 2016-11-01 |
| 9257370 | Cavity package with pre-molded cavity leadframe | — | 2016-02-09 |
| 8330270 | Integrated circuit package having a plurality of spaced apart pad portions | Geraldine Tsui Yee Lin, Walter de Munnik, Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang +1 more | 2012-12-11 |
| 7595225 | Leadless plastic chip carrier with contact standoff | Kin Pul Kwan, Hoi Chi Wong, Neil McLellan | 2009-09-29 |
| 7482690 | Electronic components such as thin array plastic packages and process for fabricating same | Kwok Cheung Tsang | 2009-01-27 |
| 7449771 | Multiple leadframe laminated IC package | Tsui Yee Lin, Kin Pui Kwan, Shui Ming Tse, Wing Him Lau, Shuk Man Wong | 2008-11-11 |
| 7439099 | Thin ball grid array package | Kwok Cheung Tsang, William Lap Keung Chow | 2008-10-21 |
| 7410830 | Leadless plastic chip carrier and method of fabricating same | Tsui Yee Lin, Ping Sheung Lau | 2008-08-12 |
| 7411289 | Integrated circuit package with partially exposed contact pads and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Mohan Kirloskar, Ed A. Varga | 2008-08-12 |
| 7372151 | Ball grid array package and process for manufacturing same | Neil McLellan, Kwok Cheung Tsang | 2008-05-13 |
| 7371610 | Process for fabricating an integrated circuit package with reduced mold warping | Mohan Kirloskar, Neil McLellan | 2008-05-13 |
| 7315080 | Ball grid array package that includes a collapsible spacer for separating die adapter from a heat spreader | Wing Keung Lam, Ming Wang Sze, Sadak Thamby Labeeb, Neil McLellan, Mohan Kirloskar | 2008-01-01 |
| 7271032 | Leadless plastic chip carrier with etch back pad singulation | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan, Wing Him Lau | 2007-09-18 |
| 7270867 | Leadless plastic chip carrier | Kin Pui Kwan, Wing Him Lau, Kwok Cheung Tsang, Neil McLellan | 2007-09-18 |
| 7247526 | Process for fabricating an integrated circuit package | Neil McLellan, Wing Him Lau, Emily Shui Ming Tse | 2007-07-24 |
| 7232755 | Process for fabricating pad frame and integrated circuit package | Neil McLellan, Kwok Cheung Tsang, Kin Pui Kwan | 2007-06-19 |
| 7226811 | Process for fabricating a leadless plastic chip carrier | Neil McLellan, Kin Pui Kwan, Wing Him Lau | 2007-06-05 |
| 7091581 | Integrated circuit package and process for fabricating the same | Neil McLellan, Geraldine Tsui Yee Lin, Mohan Kirloskar, Ed A. Varga | 2006-08-15 |