Issued Patents All Time
Showing 25 most recent of 300 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431390 | Contact features of semiconductor devices | Tsui-Ling Yen | 2025-09-30 |
| 12416789 | Lens assembly | Hsi-Ling Chang, Guo-Yang Wu, Bo-Yan Chen | 2025-09-16 |
| 12411808 | System and method for obtaining instrumentation data | Rajeev Thakur, Mehran Farimani | 2025-09-09 |
| 12408428 | Integrated circuit, method for forming a layout of integrated circuit using standard cells | Ruei-Yau Chen, Wei Wang, Kun-Yuan Wu, Chien-Fu Chen, Chen-Hsien Hsu | 2025-09-02 |
| 12406125 | Integrated circuit layout including standard cells and method to form the same | Ruei-Yau Chen, Wei Wang, Kun-Yuan Wu, Chien-Fu Chen, Chen-Hsien Hsu | 2025-09-02 |
| 12396265 | Semiconductor structure and manufacturing method thereof | Chun-Hsien Lin, Ruei-Yau Chen | 2025-08-19 |
| 12380066 | System and method for selecting instrumentation technique | Rajeev Thakur, Mehran Farimani | 2025-08-05 |
| 12356599 | Static random access memory | Chih-Kai Hsu | 2025-07-08 |
| 12322716 | Heat dissipating features for laser drilling process | Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo, Li-Hsien Huang +2 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-05-27 |
| 12278146 | Fin field-effect transistor device and method of forming the same | Che-Yu Lin, Chien-Wei Lee, Wen-Chu Hsiao, Yee-Chia Yeo | 2025-04-15 |
| 12276972 | Wafer scheduling method and wafer scheduling apparatus for etching equipment | Jianping Wang, Jinjin Cao | 2025-04-15 |
| 12255156 | Semiconductor package with riveting structure between two rings and method for forming the same | Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-03-18 |
| 12249539 | Multigate device structure with engineered cladding and method making the same | Shu-Wen Shen, Jiun-Ming Kuo, Yuan-Ching Peng, Ji-Xuan YANG, Jheng-Wei LIN | 2025-03-11 |
| 12237404 | Methods for increasing germanium concentration of surfaces of a silicon germanium portion of a Fin and resulting semiconductor devices | Che-Yu Lin, Wen-Chu Hsiao | 2025-02-25 |
| 12218023 | Semiconductor package and method of forming the same | Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-02-04 |
| 12148809 | Layout pattern of static random access memory | Chun-Hsien Huang, Yu-Tse Kuo, Shu-Ru Wang, Li-Ping Huang, Chun-Yen Tseng | 2024-11-19 |
| 12124016 | Lens assembly | Hsi-Ling Chang, Ming-Huang Tseng, Guo-Yang Wu, Bo-Yan Chen | 2024-10-22 |
| 12119296 | Encircling a semiconductor device with stacked frames on a substrate | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2024-10-15 |
| 12119053 | Method of programming MLC memory device and related MLC memory device | Chia-Wen Wang, Chia-Hui Huang, Jen Yang Hsueh, Ling-Hsiu Chou, Chih-Yang Hsu | 2024-10-15 |
| 12112984 | Contact features of semiconductor devices | Tsui-Ling Yen | 2024-10-08 |
| 12087705 | Package structure with warpage-control element | Yu-Sheng Lin, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2024-09-10 |
| 12055698 | Lens assembly | Hsi-Ling Chang, Chun-Yang Yao, Ming-Huang Tseng | 2024-08-06 |
| 12025143 | Mixed flow fan with enhanced heat dissipation efficiency | Shun-Chen Chang, Chao-Fu Yang, Chien-Chih Huang | 2024-07-02 |
| 12021042 | Semiconductor package and method of manufacturing the same | Kai-Ming Ching, Shu-Shen Yeh, Hui Yu, Yu-Min Cheng | 2024-06-25 |