Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11176306 | Methods and systems to perform automated Integrated Fan-Out wafer level package routing | About Liao, Happy Wang, Pagan Chou, Cheng-Chieh Chen, Philippe Aubert McComber +1 more | 2021-11-16 |
| 11126780 | Automatic net grouping and routing | Yi-Ting Chung, Kuan-Yu Liao, Shih-Pin Hung, Kaichih Chi, Chun-Cheng Chi | 2021-09-21 |
| 9305843 | Chip package and method for forming the same | Chien-Hui Chen, Shu-Ming Chang, Tsang-Yu Liu, Yen-Shih Ho | 2016-04-05 |
| 8878367 | Substrate structure with through vias | Chia-Sheng Lin, Chien-Hui Chen, Tzu-Hsiang Hung | 2014-11-04 |
| 8836134 | Semiconductor stacked package and method of fabricating the same | Po-Shen Lin, Chuan-Jin Shiu, Chen-Han Chiang, Chien-Hui Chen, Hsi-Chien Lin +1 more | 2014-09-16 |