Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12120878 | Block-to-block isolation and deep contact using pillars in a memory array | Deepak Thimmegowda, Brian Cleereman, Srivardhan Gowda, Jui-Yen Lin, Liu Liu +2 more | 2024-10-15 |
| 11935756 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2024-03-19 |
| 11335563 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2022-05-17 |
| 10784086 | Cobalt etch back | Jialing Yang, Meihua Shen, Thorsten Lill, John Hoang | 2020-09-22 |
| 10607844 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2020-03-31 |
| 10096483 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2018-10-09 |
| 9870899 | Cobalt etch back | Jialing Yang, Meihua Shen, Thorsten Lill, John Hoang | 2018-01-16 |
| 9761457 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2017-09-12 |
| 9679781 | Methods for integrated circuit fabrication with protective coating for planarization | Mirzafer Abatchev, David H. Wells, Krupakar M. Subramanian | 2017-06-13 |
| 9589853 | Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber | Monica Titus, Gowri Kamarthy, Harmeet Singh, Yoshie Kimura, Meihua Shen +2 more | 2017-03-07 |
| 9570320 | Method to etch copper barrier film | Meihua Shen, Ji Zhu, Shuogang Huang, John Hoang, Prithu Sharma +1 more | 2017-02-14 |
| 9330934 | Methods of forming patterns on substrates | Alex J. Schrinsky | 2016-05-03 |
| 9305782 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greely +1 more | 2016-04-05 |
| 9184159 | Simplified pitch doubling process flow | Ardavan Niroomand, Ramakanth Alapati | 2015-11-10 |
| 9003651 | Methods for integrated circuit fabrication with protective coating for planarization | Mirzafer Abatchev, David H. Wells, Krupakar M. Subramanian | 2015-04-14 |
| 8980752 | Method of forming a plurality of spaced features | Farrell M. Good, Xiaolong Fang, Fatma Arzum Simsek-Ege | 2015-03-17 |
| 8871648 | Method for forming high density patterns | Gurtej S. Sandhu, Ardavan Niroomand | 2014-10-28 |
| 8852851 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng, Joseph Neil Greeley +1 more | 2014-10-07 |
| 8836083 | Methods to reduce the critical dimension of semiconductor devices and related semiconductor devices | — | 2014-09-16 |
| 8530352 | Methods of patterning a material | Vishal Sipani, Ming-Chuan Yang | 2013-09-10 |
| 8492278 | Method of forming a plurality of spaced features | Farrell M. Good, Xiaolong Fang, Fatma Arzum Simsek-Ege | 2013-07-23 |
| 8479384 | Methods for integrated circuit fabrication with protective coating for planarization | Mirzafer Abatchev, David H. Wells, Krupakar M. Subramanian | 2013-07-09 |
| 8389407 | Methods of patterning materials | Vishal Sipani, Ming-Chuan Yang | 2013-03-05 |
| 8338959 | Simplified pitch doubling process flow | Ardavan Niroomand, Ramakanth Alapati | 2012-12-25 |
| 8338304 | Methods to reduce the critical dimension of semiconductor devices and related semiconductor devices | — | 2012-12-25 |