| 7227268 |
Placement of sacrificial solder balls underneath the PBGA substrate |
Chi-Shih Chang, William T. Chen |
2007-06-05 |
| 6829149 |
Placement of sacrificial solder balls underneath the PBGA substrate |
Chi-Shih Chang, William T. Chen |
2004-12-07 |
| 6674647 |
Low or no-force bump flattening structure and method |
Mark V. Pierson |
2004-01-06 |
| 6559666 |
Method and device for semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Charles G. Woychik |
2003-05-06 |
| 6492071 |
Wafer scale encapsulation for integrated flip chip and surface mount technology assembly |
William E. Bernier, Mark V. Pierson |
2002-12-10 |
| 6453537 |
Cooling method for electronic components |
Craig G. Heim, Wade Leslie Hooker |
2002-09-24 |
| 6437254 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel |
2002-08-20 |
| 6353182 |
Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
Chi-Shih Chang, William T. Chen |
2002-03-05 |
| 6295724 |
Apparatus for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel |
2001-10-02 |
| 6288559 |
Semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Charles G. Woychik |
2001-09-11 |
| 6268739 |
Method and device for semiconductor testing using electrically conductive adhesives |
William E. Bernier, Michael A. Gaynes, Wayne J. Howell, Mark V. Pierson, Charles G. Woychik |
2001-07-31 |
| 6255599 |
Relocating the neutral plane in a PBGA substrate to eliminate chip crack and interfacial delamination |
Chi-Shih Chang, William T. Chen |
2001-07-03 |
| 6115912 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel |
2000-09-12 |
| 6034875 |
Cooling structure for electronic components |
Craig G. Heim, Wade Leslie Hooker |
2000-03-07 |
| 6018866 |
Apparatus and method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel |
2000-02-01 |
| 5959348 |
Construction of PBGA substrate for flip chip packing |
Chi-Shih Chang, William T. Chen |
1999-09-28 |
| 5809641 |
Method for printed circuit board repair |
Alan Harris Crudo, John G. Davis, Christian Robert Le Coz, Mark V. Pierson, Amit K. Sarkhel |
1998-09-22 |
| 5685070 |
Method of making printed circuit board |
Warren A. Alpaugh, Voya R. Markovich, Richard Stuart Zarr |
1997-11-11 |
| 5620782 |
Method of fabricating a flex laminate package |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1997-04-15 |
| 5509196 |
Method of fabricating a flex laminate package |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1996-04-23 |
| 5435480 |
Method for filling plated through holes |
Paul Joseph Hart, Kishor Desai, Edward Vytlacil |
1995-07-25 |
| 5418689 |
Printed circuit board or card for direct chip attachment and fabrication thereof |
Warren A. Alpaugh, Voya R. Markovich, Richard Stuart Zarr |
1995-05-23 |
| 5384690 |
Flex laminate package for a parallel processor |
Charles R. Davis, Thomas P. Duffy, Steven L. Hanakovic, Howard L. Heck, John T. Kolias +2 more |
1995-01-24 |
