| 12032892 |
Semiconductor layout context around a point of interest |
Mohamed Alimam Mohamed Selim, Mohamed Bahnas, Hazem Hegazy, Ahmed Hamed Fathi Hamed |
2024-07-09 |
|
| 10552565 |
Simultaneous multi-layer fill generation |
Eugene Anikin, Fedor G. Pikus, Laurence W. Grodd, John W. Stedman |
2020-02-04 |
|
| 9652574 |
Simultaneous multi-layer fill generation |
Eugene Anikin, Fedor G. Pikus, Laurence W. Grodd, John W. Stedman |
2017-05-16 |
|
| 8612919 |
Model-based design verification |
Fedor G. Pikus |
2013-12-17 |
$10,671,000 |
| 7930655 |
Yield profile manipulator |
ChandraSekhar Desu, Nima A. Behkami, Bruce Whitefield, David J. Sturtevant |
2011-04-19 |
|
| 7725849 |
Feature failure correlation |
Bernd Koenemann |
2010-05-25 |
$8,712,000 |
| 7653523 |
Method for calculating high-resolution wafer parameter profiles |
Bruce Whitefield |
2010-01-26 |
$12,824,000 |
| 7460211 |
Apparatus for wafer patterning to reduce edge exclusion zone |
Bruce Whitefield |
2008-12-02 |
$3,082,000 |
| 7454387 |
Method of isolating sources of variance in parametric data |
Thaddeus T. Shannon, III, James McNames |
2008-11-18 |
$5,408,000 |
| 7395522 |
Yield profile manipulator |
ChandraSekhar Desu, Nima A. Behkami, Bruce Whitefield, David J. Sturtevant |
2008-07-01 |
$7,094,000 |
| 7390680 |
Method to selectively identify reliability risk die based on characteristics of local regions on the wafer |
Ramon Gonzales, Kevin Cota, Manu Rehani |
2008-06-24 |
$11,994,000 |
| 7174281 |
Method for analyzing manufacturing data |
— |
2007-02-06 |
$5,364,000 |
| 7137098 |
Pattern component analysis and manipulation |
Bruce Whitefield, David Ray Turner, James McNames |
2006-11-14 |
$11,206,000 |
| 7062415 |
Parametric outlier detection |
Bruce Whitefield, David Ray Turner, James McNames |
2006-06-13 |
$1,683,000 |
| 7039556 |
Substrate profile analysis |
Bruce Whitefield |
2006-05-02 |
$3,544,000 |
| 6980917 |
Optimization of die yield in a silicon wafer “sweet spot” |
Mark Ward, Larry Kelley |
2005-12-27 |
$4,269,000 |
| 6880140 |
Method to selectively identify reliability risk die based on characteristics of local regions on the wafer |
Ramon Gonzales, Kevin Cota, Manu Rehani |
2005-04-12 |
$3,219,000 |
| 6807655 |
Adaptive off tester screening method based on intrinsic die parametric measurements |
Manu Rehani, Kevin Cota, Robert Madge |
2004-10-19 |
$1,881,000 |
| 6658361 |
Heaviest only fail potential |
Manu Rehani, Ramkumar Vaidyanathan |
2003-12-02 |
$6,728,000 |
| 5937324 |
Method for forming a line-on-line multi-level metal interconnect structure for use in integrated circuits |
Rickey S. Brownson, Michael R. Cherniawski |
1999-08-10 |
$18,429,000 |
| 5798568 |
Semiconductor component with multi-level interconnect system and method of manufacture |
Rickey S. Brownson, Michael R. Cherniawski |
1998-08-25 |
$10,159,000 |
| 5666063 |
Method and apparatus for testing an integrated circuit |
Whitson G. Waldo, III |
1997-09-09 |
$9,869,000 |
