Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method to selectively identify reliability risk die based on characteristics of local regions on the wafer

Method to selectively identify reliability risk die based on characteristics of local regions on the wafer

US Patent 6880140 · Granted Apr 12, 2005

Estimated economic value: $3,219,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor layout context around a point of interest2024
Simultaneous multi-layer fill generation2020
Storage system for pervasive and mobile content2017
Real-time autonomous organization2017
Simultaneous multi-layer fill generation2017
Methods and systems for measuring semantics in communications2016
Format for displaying text analytics results2015
Taxonomy and application of language analysis and processing2015
Enactive perception device2015
Model-based design verification2013
Methods and systems for identifying, quantifying, analyzing, and optimizing the 2013
Yield profile manipulator2011