Issued Patents All Time
Showing 51–67 of 67 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8436969 | Photo alignment process and liquid crystal display using the same | Yao-Jen Ou, Hang-Lian Lee, Bo-Chin Tsuei | 2013-05-07 |
| 8421986 | Substrate with multi-domain vertical alignment pixel structure and fabricating method thereof, liquid crystal display panel and liquid crystal display | Chien-Hong Chen, Chih-Yung Hsieh, Wei-Jen Lo, Chun-Hsu Lin, Ching-Che Yang +1 more | 2013-04-16 |
| 8373285 | Chip module | — | 2013-02-12 |
| 8358393 | Thin film transistor array for a liquid crystal display device and related manufacturing and operation methods | Chih-Yung Hsieh, Chien-Hong Chen | 2013-01-22 |
| 8247889 | Package having an inner shield and method for making the same | Kuo-Hsien Liao | 2012-08-21 |
| 8212339 | Semiconductor device packages with electromagnetic interference shielding | Kuo-Hsien Liao, Chen-Chuan Fan, Chi-Tsung Chiu, Chih-Pin Hung | 2012-07-03 |
| 8110931 | Wafer and semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Wei Chi Yih +6 more | 2012-02-07 |
| 8076786 | Semiconductor package and method for packaging a semiconductor package | Chang Ying Hung, Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Wei Chi Yih +1 more | 2011-12-13 |
| 8053906 | Semiconductor package and method for processing and bonding a wire | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Wei Chi Yih +3 more | 2011-11-08 |
| 8018075 | Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package | Hsiao-Chuan Chang, Tsung-Yueh Tsai, Yi-Shao Lai, Ho-Ming Tong, Wei Chi Yih +1 more | 2011-09-13 |
| 7709913 | Image sensor package and packaging method for the same | — | 2010-05-04 |
| 7446295 | Image sensor module having an image signal processor being physically and electrically unconnected to a supporting board of an image sensor chip | Ming-Hsiang Cheng, Chia-Jung Lee | 2008-11-04 |
| 7333263 | Transition metal doped fiber amplifier | Sheng-Lung Huang, Chia-Yao Lo, Kwang-Yao Huang, Chiang-Yuan Chuang, Chien-Chih Lai +2 more | 2008-02-19 |
| 7256066 | Flip chip packaging process | Yu-Wen Chen, Sheng-Yu Wu | 2007-08-14 |
| 7184266 | Automatic monitor sliding system | Chun-Chang Shih | 2007-02-27 |
| 6700178 | Package of a chip with beveled edges | Wei-Min Hsiao | 2004-03-02 |
| 6201299 | Substrate structure of BGA semiconductor package | Su Tao, Chih-Ming Chung, Chun-Chi Lee | 2001-03-13 |