Issued Patents All Time
Showing 26–50 of 82 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9190389 | Chip package with passives | Georg Meyer-Berg, Joachim Mahler | 2015-11-17 |
| 9171804 | Method for fabricating an electronic component | Georg Meyer-Berg, Joachim Mahler, Edward Fuergut | 2015-10-27 |
| 9171787 | Packaged semiconductor device having an embedded system | Joachim Mahler, Georg Meyer-Berg | 2015-10-27 |
| 9165847 | Semiconductor device including a material to absorb thermal energy | Joachim Mahler, Ralf Otremba | 2015-10-20 |
| 9165792 | Integrated circuit, a chip package and a method for manufacturing an integrated circuit | Joachim Mahler, Anton Mauder | 2015-10-20 |
| 9159701 | Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly | Joachim Mahler, Franz-Peter Kalz, Joachim Voelter, Ralf Wombacher | 2015-10-13 |
| 9123708 | Semiconductor chip package | Thomas Wowra, Joachim Mahler, Ralf Wombacher | 2015-09-01 |
| 9093416 | Chip-package and a method for forming a chip-package | Manfred Mengel, Thomas Wowra, Joachim Mahler | 2015-07-28 |
| 9082767 | Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package | Joachim Mahler, Edward Fuergut, Georg Meyer-Berg | 2015-07-14 |
| 9070568 | Chip package with embedded passive component | Joachim Mahler, Georg Meyer-Berg | 2015-06-30 |
| 9054040 | Multi-die package with separate inter-die interconnects | Joachim Mahler, Josef Höglauer | 2015-06-09 |
| 9048338 | Device including two power semiconductor chips and manufacturing thereof | Manfred Mengel, Joachim Mahler, Franz-Peter Kalz | 2015-06-02 |
| 9041226 | Chip arrangement and a method of manufacturing a chip arrangement | Rainer Steiner, Edward Fuergut, Georg Meyer-Berg, Joachim Mahler | 2015-05-26 |
| 9021887 | Micromechanical semiconductor sensing device | Franz-Peter Kalz, Horst Theuss, Bernhard Winkler, Joachim Mahler, Manfred Mengel | 2015-05-05 |
| 9018744 | Semiconductor device having a clip contact | Ralf Otremba, Josef Hoeglauer | 2015-04-28 |
| 8993381 | Method for forming a thin semiconductor device | — | 2015-03-31 |
| 8947886 | Electronic component | Joachim Mahler, Manfred Mengel, Klaus Schmidt, Franz-Peter Kalz | 2015-02-03 |
| 8912450 | Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module | Joachim Mahler, Manfred Mengel, Franz-Peter Kalz | 2014-12-16 |
| 8912047 | Method for producing a metal layer on a substrate and device | Hans-Joachim Schulze | 2014-12-16 |
| 8896128 | Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit | Joachim Mahler, Georg Meyer-Berg | 2014-11-25 |
| 8884434 | Method and system for improving reliability of a semiconductor device | Manfred Mengel, Joachim Mahler | 2014-11-11 |
| 8884420 | Multichip device | Joachim Mahler, Ivan Nikitin | 2014-11-11 |
| 8872315 | Electronic device and method of fabricating an electronic device | Joachim Mahler, Ivan Nikitin, Gottfried Beer | 2014-10-28 |
| 8835219 | Device contact, electric device package and method of manufacturing an electric device package | Joachim Mahler | 2014-09-16 |
| 8836120 | Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer | Manfred Mengel, Joachim Mahler | 2014-09-16 |