WM

William H. Ma

IBM: 70 patents #1,048 of 70,183Top 2%
📍 Wappingers Falls, NY: #21 of 884 inventorsTop 3%
🗺 New York: #1,072 of 115,490 inventorsTop 1%
Overall (All Time): #29,535 of 4,157,543Top 1%
70
Patents All Time

Issued Patents All Time

Showing 26–50 of 70 patents

Patent #TitleCo-InventorsDate
6444402 Method of making differently sized vias and lines on the same lithography level Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak 2002-09-03
6420748 Borderless bitline and wordline DRAM structure Mark C. Hakey, David V. Horak, Wendell P. Noble 2002-07-16
6391426 High capacitance storage node structures Mark C. Hakey, Steven J. Holmes, David V. Horak 2002-05-21
6358813 Method for increasing the capacitance of a semiconductor capacitors Steven J. Holmes, Charles T. Black, David J. Frank, Toshiharu Furukawa, Mark C. Hakey +3 more 2002-03-19
6342323 Alignment methodology for lithography David V. Horak, Toshiharu Furukawa, Steven J. Holmes, Mark C. Hakey 2002-01-29
6333245 Method for introducing dopants into semiconductor devices using a germanium oxide sacrificial layer Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Donald W. Rakowski 2001-12-25
6319759 Method for making oxide Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak 2001-11-20
6291858 Multistack 3-dimensional high density semiconductor device and method for fabrication Dominic J. Schepis 2001-09-18
6281576 Method of fabricating structure for chip micro-joining Mark C. Hakey 2001-08-28
6271599 Wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate Birendra Agarwala 2001-08-07
6268259 Overhanging separator for self-defining stacked capacitor David E. Kotecki 2001-07-31
6262450 DRAM stack capacitor with vias and conductive connection extending from above conductive lines to the substrate David E. Kotecki 2001-07-17
6261933 Process for building borderless bitline, wordline amd DRAM structure Mark C. Hakey, David V. Horak, Wendell P. Noble 2001-07-17
6232170 Method of fabricating trench for SOI merged logic DRAM Mark C. Hakey 2001-05-15
6228705 Overlay process for fabricating a semiconductor device Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak 2001-05-08
6225158 Trench storage dynamic random access memory cell with vertical transfer device Toshiharu Furukawa, Mark C. Hakey, David V. Horak, Jack A. Mandelman 2001-05-01
6221562 Resist image reversal by means of spun-on-glass Diane C. Boyd, Toshiharu Furukawa, Steven J. Holmes, Paul A. Rabidoux, David V. Horak 2001-04-24
6207540 Method for manufacturing high performance MOSFET device with raised source and drain Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, Jack A. Mandelman 2001-03-27
6191469 Overhanging separator for self-defining discontinuous film David E. Kotecki 2001-02-20
6190988 Method for a controlled bottle trench for a dram storage node Toshiharu Furukawa, Mark C. Hakey, Steven J. Holmes, David V. Horak, James M. Never 2001-02-20
6184549 Trench storage dynamic random access memory cell with vertical transfer device Toshiharu Furukawa, Mark C. Hakey, David V. Horak, Jack A. Mandelman 2001-02-06
6184151 Method for forming cornered images on a substrate and photomask formed thereby William J. Adair, Richard A. Ferguson, Mark C. Hakey, Steven J. Holmes, David V. Horak +3 more 2001-02-06
6175128 Process for building borderless bitline, wordline and DRAM structure and resulting structure Mark C. Hakey, David V. Horak, Wendell P. Noble 2001-01-16
6153491 Overhanging separator for self-defining discontinuous film David E. Kotecki 2000-11-28
6150230 Trench separator for self-defining discontinuous film David E. Kotecki 2000-11-21