Issued Patents All Time
Showing 26–45 of 45 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10593616 | Reduction of stress in via structure | Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2020-03-17 |
| 10566302 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2020-02-18 |
| 10553553 | Method of forming a solder bump structure | Takashi Hisada, Eiji Nakamura | 2020-02-04 |
| 10424510 | Solder fill into high aspect through holes | Akihiro Horibe, Kuniaki Sueoka, Kazushige Toriyama | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Akihiro Horibe, Kuniaki Sueoka, Kazushige Toriyama | 2019-08-20 |
| 10325839 | Reduction of stress in via structure | Takashi Hisada, Akihiro Horibe, Sayuri Hada, Eiji Nakamura, Kuniaki Sueoka | 2019-06-18 |
| 10252363 | Forming a solder joint between metal layers | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2019-04-09 |
| 10115692 | Method of forming solder bumps | Takashi Hisada, Hiroyuki Mori, Eiji Nakamura, Yasumitsu Orii | 2018-10-30 |
| 10103118 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2018-10-16 |
| 10090586 | Wireless communication device with joined semiconductors | Noam Kaminski, Keishi Okamoto, Kazushige Toriyama | 2018-10-02 |
| 10037958 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2018-07-31 |
| 10037967 | Injection molded solder bumping | Takashi Hisada, Eiji Nakamura, Kuniaki Sueoka | 2018-07-31 |
| 9859241 | Method of forming a solder bump structure | Takashi Hisada, Eiji Nakamura | 2018-01-02 |
| 9837367 | Fabrication of solder balls with injection molded solder | Takashi Hisada, Eiji Nakamura | 2017-12-05 |
| 9780442 | Wireless communication device with joined semiconductors | Noam Kaminski, Keishi Okamoto, Kazushige Toriyama | 2017-10-03 |
| 9586281 | Forming a solder joint between metal layers | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Ting-Li Yang | 2017-03-07 |
| 9520375 | Method of forming a solder bump on a substrate | Hiroyuki Mori, Yasumitsu Orii, Kazushige Toriyama, Shintaro Yamamichi | 2016-12-13 |
| 9508594 | Fabricating pillar solder bump | Hiroyuki Mori, Kazushige Toriyama | 2016-11-29 |
| 9299606 | Fabricating pillar solder bump | Hiroyuki Mori, Kazushige Toriyama | 2016-03-29 |
| 7250311 | Wirebond crack sensor for low-k die | Lloyd Burrell, Wolfgang Sauter | 2007-07-31 |