Issued Patents All Time
Showing 101–118 of 118 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8957465 | Formation of the dielectric cap layer for a replacement gate structure | Ruilong Xie, Balasubramanian S. Pranatharthi Haran, David V. Horak | 2015-02-17 |
| 8853076 | Self-aligned contacts | David V. Horak, Shom Ponoth, David L. Rath, Muthumanickam Sankarapandian | 2014-10-07 |
| 8796783 | Borderless contact structure employing dual etch stop layers | David V. Horak, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-08-05 |
| 8772168 | Formation of the dielectric cap layer for a replacement gate structure | Ruilong Xie, Balasubramanian S. Pranatharthi Haran, David V. Horak | 2014-07-08 |
| 8765585 | Method of forming a borderless contact structure employing dual etch stop layers | David V. Horak, Charles W. Koburger, III, Shom Ponoth, Chih-Chao Yang | 2014-07-01 |
| 8741752 | Borderless contacts in semiconductor devices | David V. Horak, Sivananda K. Kanakasabapathy | 2014-06-03 |
| 8679909 | Recessing and capping of gate structures with varying metal compositions | Ruilong Xie, David V. Horak, Pranatharthiharan Haran Balasubramanian | 2014-03-25 |
| 8679968 | Method for forming a self-aligned contact opening by a lateral etch | Ruilong Xie, Pranatharthiharan Haran Balasubramanian, David V. Horak, Ponoth Shom | 2014-03-25 |
| 8637908 | Borderless contacts in semiconductor devices | David V. Horak, Sivananda K. Kanakasabapathy | 2014-01-28 |
| 8383490 | Borderless contact for ultra-thin body devices | Balasubramanian S. Haran, David V. Horak | 2013-02-26 |
| 8232659 | Three dimensional IC device and alignment methods of IC device substrates | Hsueh-Chung Chen, Chine-Gie Lou | 2012-07-31 |
| 8124525 | Method of forming self-aligned local interconnect and structure formed thereby | Charles W. Koburger, III, David V. Horak, Shom Pomoth, Chih-Chao Yang, Sivananda K. Kanakasabapathy | 2012-02-28 |
| 8084311 | Method of forming replacement metal gate with borderless contact and structure thereof | David V. Horak, Theodorus E. Standaert | 2011-12-27 |
| 7781892 | Interconnect structure and method of fabricating same | Hsueh-Chung Chen, Chine-Gie Lou, Ping Liu | 2010-08-24 |
| 7371663 | Three dimensional IC device and alignment methods of IC device substrates | Hsueh-Chung Chen, Chine-Gie Lou | 2008-05-13 |
| 7301239 | Wiring structure to minimize stress induced void formation | Chien-Jung Wang, Ding-Da Hu, Hsueh-Chung Chen | 2007-11-27 |
| 6743485 | Pre-treatment for salicide process | — | 2004-06-01 |
| 6254739 | Pre-treatment for salicide process | — | 2001-07-03 |