SK

Steven J. Koester

IBM: 60 patents #1,306 of 70,183Top 2%
UM University of Minnesota: 16 patents #31 of 2,951Top 2%
HS Hanon Systems: 9 patents #68 of 877Top 8%
SE Siemens Energy: 4 patents #177 of 1,016Top 20%
SG Siemens Energy Global: 3 patents #86 of 1,160Top 8%
SA Siemens Aktiengesellschaft: 2 patents #6,658 of 22,248Top 30%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
Boston Scientific Scimed: 2 patents #1,673 of 3,579Top 50%
📍 Edina, MN: #4 of 909 inventorsTop 1%
🗺 Minnesota: #221 of 52,454 inventorsTop 1%
Overall (All Time): #15,572 of 4,157,543Top 1%
96
Patents All Time

Issued Patents All Time

Showing 26–50 of 96 patents

Patent #TitleCo-InventorsDate
10712302 Ultra-compact, passive, varactor-based wireless sensor using quantum capacitance effect in graphene 2020-07-14
10526900 Shrouded turbine blade Kok-Mun Tham, Ching-Pang Lee, Eric Chen 2020-01-07
10196906 Turbine blade with a non-constraint flow turning guide structure Ching-Pang Lee, Yuekun Zhou, Adhlere Coffy 2019-02-05
10191005 Ultra-compact, passive, varactor-based wireless sensor using quantum capacitance effect in graphene 2019-01-29
10060270 Internal cooling system with converging-diverging exit slots in trailing edge cooling channel for an airfoil in a turbine engine Ching-Pang Lee, Caleb Myers, Erik Johnson 2018-08-28
9805949 High κ gate stack on III-V compound semiconductors Jean Fompeyrine, Edward W. Kiewra, Devendra K. Sadana, David J. Webb 2017-10-31
9745853 Integrated circuit cooled turbine blade Ching-Pang Lee, Nan Jiang, Jae Y. Um, Harry Holloman 2017-08-29
9631506 Turbine abradable layer with composite non-inflected bi-angle ridges and grooves Ching-Pang Lee, Erik Johnson 2017-04-25
9513244 Ultra-compact, passive, varactor-based wireless sensor using quantum capacitance effect in graphene 2016-12-06
9494043 Turbine blade having contoured tip shroud Ching-Pang Lee, Kok-Mun Tham, Eric Chen 2016-11-15
9178061 Method for fabricating MOSFET on silicon-on-insulator with internal body contact Jin Cai, Amlan Majumdar 2015-11-03
8969992 Autonomous integrated circuits Stephen W. Bedell, Norma E. Sosa Cortes, Wilfried E. Haensch, Devendra K. Sadana, Katherine L. Saenger +2 more 2015-03-03
8962448 Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Fei Liu, Sampath Purushothaman +2 more 2015-02-24
8796735 Fabrication of a vertical heterojunction tunnel-FET Isaac Lauer, Amlan Majumdar, Paul M. Solomon 2014-08-05
8766410 Embedded DRAM integrated circuits with extremely thin silicon-on-insulator pass transistors Jin Cai, Josephine B. Chang, Leland Chang, Brian L. Ji, Amlan Majumdar 2014-07-01
8738167 3D integrated circuit device fabrication with precisely controllable substrate removal Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Sampath Purushothaman, Roy R. Yu 2014-05-27
8722492 Nanowire pin tunnel field effect devices Sarunya Bangsaruntip, Amlan Majumdar, Jeffrey W. Sleights 2014-05-13
8716810 Selective floating body SRAM cell Josephine B. Chang, Leland Chang, Jeffrey W. Sleight 2014-05-06
8674515 3D integrated circuits structure Mukta G. Farooq, Subramanian S. Iyer, Huilong Zhu 2014-03-18
8664081 Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Fei Liu, Sampath Purushothaman +2 more 2014-03-04
8629553 3D integrated circuit device fabrication with precisely controllable substrate removal Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Sampath Purushothaman, Roy R. Yu 2014-01-14
8587121 Backside dummy plugs for 3D integration Fei Liu 2013-11-19
8492869 3D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer Mukta G. Farooq, Robert Hannon, Subramanian S. Iyer, Fei Liu, Sampath Purushothaman +2 more 2013-07-23
8432723 Nano-electro-mechanical DRAM cell Josephine B. Chang, Leland Chang, Michael A. Guillorn, Brian J. Li 2013-04-30
8431476 Method to prevent surface decomposition of III-V compound semiconductors Joel P. de Souza, Keith E. Fogel, Edward W. Kiewra, Christopher C. Parks, Devendra K. Sadana +1 more 2013-04-30