RM

Roy H. Magnuson

IBM: 24 patents #4,429 of 70,183Top 7%
ET Endicott Interconnect Technologies: 8 patents #14 of 87Top 20%
SF SUNY Research Foundation: 2 patents #223 of 1,165Top 20%
IB International Business: 1 patents #4 of 119Top 4%
📍 Endicott, NY: #9 of 620 inventorsTop 2%
🗺 New York: #3,082 of 115,490 inventorsTop 3%
Overall (All Time): #94,439 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 26–36 of 36 patents

Patent #TitleCo-InventorsDate
6201194 Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric John M. Lauffer, Voya R. Markovich, John A. Welsh 2001-03-13
6179990 Biased acid cleaning of a copper-invar-copper laminate Raymond T. Galasco, Lawrence P. Lehman, Robert D. Topa 2001-01-30
5557844 Method of preparing a printed circuit board Anilkumar C. Bhatt, Voya R. Markovich, Konstantinos I. Papathomas, Douglas O. Powell 1996-09-24
5487218 Method for making printed circuit boards with selectivity filled plated through holes Anilkumar C. Bhatt, Voya R. Markovich, Konstantinos I. Papathomas, Douglas O. Powell 1996-01-30
5427895 Semi-subtractive circuitization Richard William Malek, Voya R. Markovich, William E. Wilson 1995-06-27
4967690 Electroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance means Edmond O. Fey, Peter Haselbauer, Dae Young Jung, Ronald A. Kaschak, Hans-Dieter Kilthau +1 more 1990-11-06
4948707 Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon Robert W. Johnson, William H. Lawrence, Gary K. Lemon, Voya R. Markovich, Ralph E. Parsons +1 more 1990-08-14
4904506 Copper deposition from electroless plating bath Peter A. Burnett, Dae Young Jung, Ronald A. Kaschak, Robert G. Rickert, Stephen L. Tisdale 1990-02-27
4684545 Electroless plating with bi-level control of dissolved oxygen Edmond O. Fey, Peter Haselbauer, Dae Young Jung, Ronald A. Kaschak, Hans-Dieter Kilthau +1 more 1987-08-04
4666858 Determination of amount of anionic material in a liquid sample Steven A. Schubert 1987-05-19
4623554 Method for controlling plating rate in an electroless plating system Ronald A. Kaschak, Edward J. Yarmchuk 1986-11-18