Issued Patents All Time
Showing 101–111 of 111 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6358855 | Clean method for recessed conductive barriers | Nicolas Nagel, Christopher C. Parks | 2002-03-19 |
| 6350692 | Increased polish removal rate of dielectric layers using fixed abrasive pads | Laertis Economikos, Alexander William Simpson | 2002-02-26 |
| 6303506 | Compositions for and method of reducing/eliminating scratches and defects in silicon dioxide during CMP process | Haruki Nojo, Ronald J. Schutz | 2001-10-16 |
| 6274440 | Manufacturing of cavity fuses on gate conductor level | Kenneth C. Arndt, Axel Brintzinger, Richard A. Conti, Donna R. Cote, Chandrasekhar Narayan +2 more | 2001-08-14 |
| 6149830 | Composition and method for reducing dishing in patterned metal during CMP process | Chienting Lin, Juin-Fang Wang, Fen F. Jamin | 2000-11-21 |
| 6074935 | Method of reducing the formation of watermarks on semiconductor wafers | — | 2000-06-13 |
| 6060398 | Guard cell for etching | Axel Brintzinger, Senthil Srinivasan | 2000-05-09 |
| 5980770 | Removal of post-RIE polymer on Al/Cu metal line | Wesley C. Natzle, Martin Gutsche, Hiroyuki Akatsu, Chien-Yi Yu | 1999-11-09 |
| 5934299 | Apparatus and method for improved washing and drying of semiconductor wafers | Hiroyuki Akatsu | 1999-08-10 |
| 5932493 | Method to minimize watermarks on silicon substrates | Hiroyuki Akatsu, Ronald Hoyer | 1999-08-03 |
| 5807439 | Apparatus and method for improved washing and drying of semiconductor wafers | Hiroyuki Akatsu | 1998-09-15 |