Issued Patents All Time
Showing 26–50 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8341834 | Method of producing a land grid array (LGA) interposer structure | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2013-01-01 |
| 8316540 | Method of producing a land grid array (LGA) interposer structure | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-11-27 |
| 8267701 | Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housing | William L. Brodsky, John L. Colbert, Mark K. Hoffmeyer, Yuet-Ying Yu | 2012-09-18 |
| 8191245 | Method of forming a land grid array (LGA) interposer | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-06-05 |
| 8171630 | Method of producing a land grid array interposer | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-05-08 |
| 8136242 | Method of producing a land grid array interposer utilizing metal-on-elastomer | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2012-03-20 |
| 8123529 | Apparatus for connecting two area array devices using a printed circuit board with holes with conductors electrically connected to each other | — | 2012-02-28 |
| 8118602 | Method of connecting two area array devices using a printed circuit board with holes with conductors electrically connected to each other | — | 2012-02-21 |
| 8037600 | Method of producing a land grid array interposer structure | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2011-10-18 |
| 7975379 | Method of making a land-grid-array (LGA) interposer | Gareth G. Hougham, John Saunders Corbin, Jr., Paul W. Coteus, Shawn A. Hall, Kathleen C. Hinge +3 more | 2011-07-12 |
| 7836585 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-23 |
| 7832095 | Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-16 |
| 7832094 | Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-16 |
| 7823283 | Method of forming a land grid array interposer | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-11-02 |
| 7665999 | Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier plane | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-02-23 |
| 7658616 | Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposers | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-02-09 |
| 7641479 | Land grid array interposer (LGA) utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries that is constituted of a moldable dielectric elastometric material | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2010-01-05 |
| 7632127 | Socket and method for compensating for differing coefficients of thermal expansion | Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha | 2009-12-15 |
| 7538565 | High density integrated circuit apparatus, test probe and methods of use thereof | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2009-05-26 |
| 7530853 | Socket and method for compensating for differing coefficients of thermal expansion | Joseph Kuczynski, Theron Lee Lewis, Amanda E. Mikhail, Arvind K. Sinha | 2009-05-12 |
| 7495342 | Angled flying lead wire bonding process | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2009-02-24 |
| 7491068 | Land grid array (LGA) interposer groups of different heights utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-17 |
| 7491067 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-17 |
| 7488182 | Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier plane | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-10 |
| 7484966 | Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries | Gareth G. Hougham, Evan G. Colgan, Paul W. Coteus, Stefano S. Oggioni, Enrique Vargas | 2009-02-03 |