Issued Patents All Time
Showing 76–100 of 106 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6618942 | Method for insertion of inserting printed circuit card into socket connectors | Scott J. Hadderman, Richard D. Wheeler | 2003-09-16 |
| 6526655 | Angled flying lead wire bonding process | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2003-03-04 |
| 6528984 | Integrated compliant probe for wafer level test and burn-in | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2003-03-04 |
| 6523255 | Process and structure to repair damaged probes mounted on a space transformer | Da-Yuan Shih, Keith E. Fogel, Paul A. Lauro | 2003-02-25 |
| 6525551 | Probe structures for testing electrical interconnections to integrated circuit electronic devices | Keith E. Fogel, Paul A. Lauro, Eugene J. O'Sullivan, Da-Yuan Shih | 2003-02-25 |
| 6452406 | Probe structure having a plurality of discrete insulated probe tips | Keith E. Fogel, Paul A. Lauro, Yun-Hsin Liao, Daniel Peter Morris, Da-Yuan Shih | 2002-09-17 |
| 6380485 | Enhanced wire termination for twinax wires | Joseph Curtis Diepenbrock | 2002-04-30 |
| 6334247 | High density integrated circuit apparatus, test probe and methods of use thereof | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2002-01-01 |
| 6332270 | Method of making high density integral test probe | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2001-12-25 |
| 6329827 | High density cantilevered probe for electronic devices | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2001-12-11 |
| 6300780 | High density integrated circuit apparatus, test probe and methods of use thereof | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2001-10-09 |
| 6295729 | Angled flying lead wire bonding process | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2001-10-02 |
| 6286208 | Interconnector with contact pads having enhanced durability | Da-Yuan Shih, Paul A. Lauro, Keith E. Fogel, Maurice Heathcote Norcott | 2001-09-11 |
| 6206273 | Structures and processes to create a desired probetip contact geometry on a wafer test probe | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2001-03-27 |
| 6104201 | Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 2000-08-15 |
| 6078500 | Pluggable chip scale package | Keith E. Fogel, Paul A. Lauro, Da-Yuan Shih | 2000-06-20 |
| 6062879 | High density test probe with rigid surface structure | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 2000-05-16 |
| 5914614 | High density cantilevered probe for electronic devices | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 1999-06-22 |
| 5838160 | Integral rigid chip test probe | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1998-11-17 |
| 5821763 | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1998-10-13 |
| 5810607 | Interconnector with contact pads having enhanced durability | Da-Yuan Shih, Paul A. Lauro, Keith E. Fogel, Maurice Heathcote Norcott | 1998-09-22 |
| 5811982 | High density cantilevered probe for electronic devices | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yaun Shih | 1998-09-22 |
| 5785538 | High density test probe with rigid surface structure | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih | 1998-07-28 |
| 5635846 | Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer | Keith E. Fogel, Paul A. Lauro, Maurice Heathcote Norcott, Da-Yuan Shih, George F. Walker | 1997-06-03 |
| 5441690 | Process of making pinless connector | Juan Ayala-Esquilin, Rudolf A. Haring, James L. Hedrick, Da-Yuan Shih, George F. Walker | 1995-08-15 |