YN

Yoshihiro Nomura

HC Hitachi Chemical Company: 16 patents #69 of 1,946Top 4%
TO Toyota: 10 patents #2,889 of 26,838Top 15%
Honda Motor Co.: 10 patents #2,048 of 21,052Top 10%
KT Kabushiki Kaisha Toshiba: 4 patents #6,684 of 21,451Top 35%
Ricoh Company: 3 patents #4,826 of 9,818Top 50%
TL Toyota Central R&D Labs: 3 patents #379 of 1,657Top 25%
RE Renesas Electronics: 2 patents #1,855 of 4,529Top 45%
TT Toshiba Lighting & Technology: 1 patents #279 of 486Top 60%
HI Hitachi: 1 patents #17,742 of 28,497Top 65%
DE Denso: 1 patents #6,940 of 11,792Top 60%
Dai Nippon Printing Co.: 1 patents #1,392 of 2,222Top 65%
HC Hitachi Ulsi Systems Co.: 1 patents #577 of 867Top 70%
AC Ajinomoto Co.: 1 patents #1,164 of 2,190Top 55%
Overall (All Time): #52,499 of 4,157,543Top 2%
51
Patents All Time

Issued Patents All Time

Showing 26–50 of 51 patents

Patent #TitleCo-InventorsDate
7273654 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Yoshiyuki Tanabe, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa 2007-09-25
7097869 Nutraceutical chips and production method thereof Hitomi Hayabuchi, Reiko Miyano, Motoko Tsunematsu 2006-08-29
7061081 Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof Yasuhiro Yano, Hidekazu Matsuura, Yoshii Morishita, Touichi Sakata, Hiroshi Nishizawa +3 more 2006-06-13
6621170 Semiconductor device, substrate for mounting semiconductor chip, processes for their production, adhesive, and double-sided adhesive film Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya +5 more 2003-09-16
6558500 Method of producing a lead frame with composite film attached, and use of the lead frame Hidekazu Matsuura 2003-05-06
6523446 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame Yoshiyuki Tanabe, Hiroshi Kirihara, Youichi Hosokawa, Shinji Iioka, Satoru Yanagisawa 2003-02-25
6516201 Mobile radio communication apparatus having a plurality of MINs Masatomo Kanbara, Akira Ishikura, Osamu Kurokawa, Masakuni Hyodo, Ken Nakamura 2003-02-04
6462148 Adhesive film of quinoline polymer and bismaleimide Masahiro Suzuki, Shin Nishimura, Masao Suzuki, Akio Takahashi, Akira Kageyama +3 more 2002-10-08
6449499 Dual-mode radio connected to an apparatus for communicating through in analog mode Akira Ishikura, Osamu Kurokawa, Masakuni Hyodo, Ken Nakamura 2002-09-10
6445076 Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same Takehiro Shimizu, Takafumi Dohdoh, Kazumi Tameshige, Hidekazu Matsuura, Kunihiro Tsubosaki +3 more 2002-09-03
6408020 Dual-mode radio communication device having function for selectively using analog or digital mode Naoki KAJI, Osamu Kurokawa, Akira Ishikura, Masakuni Hyodo, Ken Nakamura +1 more 2002-06-18
6334426 Direct fuel injection-type spark-ignition internal combustion engine Kouichi Sasaki, Shizuo Abe, Fumikazu Satou, Sigemitu Iisaka, Makoto Koike 2002-01-01
6302991 Method of producing a lead frame with composite film attached, and use of the lead frame Hidekazu Matsuura 2001-10-16
6265782 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film Kazunori Yamamoto, Yasushi Shimada, Yasushi Kumashiro, Teiichi Inada, Hiroyuki Kuriya +5 more 2001-07-24
6263855 Direct fuel injection-type spark-ignition internal combustion engine Tatsuo Kobayashi, Souichi Matushita, Toshimi Kashiwagura, Shizuo Abe, Fumiaki Hattori +1 more 2001-07-24
6257199 Direct fuel injection-type spark-ignition internal combustion engine Mutsumi Kanda, Toshimi Kashiwagura, Fumiaki Hattori 2001-07-10
6154639 Handsfree unit Takuya Kanazumi, Osamu Kurokawa, Akira Ishikura, Masakuni Hyodo, Ken Nakamura 2000-11-28
5998020 Composite film and lead frame with composite film attached Hidekazu Matsuura 1999-12-07
5680818 Apparatus and system for removing dust from printing plate of printing press Yasuhiko Tomiki, Toshiyuki Ogiwara, Tadami Yoshimura, Kenichi Mizuno, Kunio Idogawa +1 more 1997-10-28
5212279 Hot-melt adhesive and its use in polyimide film and printed circuit board Takashi Morinaga, Toshiaki Fukushima, Hiroshi Minamisawa, Kazuhito Hanabusa 1993-05-18
5180786 Impact modifier, thermoplastic resin composition using the same and molded article obtained therefrom Susumu Era, Toshio Matsumoto, Yoshinori Kobayashi, Masashi Shitara, Isamu Hattori 1993-01-19
4954612 Solvent-soluble polyimide and production thereof Kazuhito Hanabusa, Hiroshi Minamisawa, Takashi Morinaga, Toichi Sakata, Yoshiyuki Mukoyama +2 more 1990-09-04
4950573 Toner for developing latent electrostatic images Kimitoshi Yamaguchi, Kazuhiko Umemura 1990-08-21
4927353 Catalytic combustion device Yoichiro Ohkubo 1990-05-22
4888263 Color toner for electrophotography Masami Tomita, Noriaki Ide, Kazumi Ohtaki 1989-12-19