Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7449076 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Satoru Yanagisawa | 2008-11-11 |
| 7273654 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Satoru Yanagisawa | 2007-09-25 |
| 6523446 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Youichi Hosokawa, Satoru Yanagisawa | 2003-02-25 |
| 6462148 | Adhesive film of quinoline polymer and bismaleimide | Masahiro Suzuki, Shin Nishimura, Masao Suzuki, Akio Takahashi, Akira Kageyama +3 more | 2002-10-08 |