Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10185165 | Optical waveguide device | Norikazu Miyazaki | 2019-01-22 |
| 10162201 | Optical modulator | Norikazu Miyazaki, Toshio Kataoka, Kei Katou | 2018-12-25 |
| 10078253 | Optical modulator | Norikazu Miyazaki, Kei Katou | 2018-09-18 |
| 10025121 | Optical waveguide element module | Kei Katou, Norikazu Miyazaki | 2018-07-17 |
| 9977270 | Optical device | Yoshizumi Ishikawa, Masayuki Motoya, Satoshi Oikawa | 2018-05-22 |
| 9778539 | Optical modulation device | Norikazu Miyazaki, Toshio Kataoka | 2017-10-03 |
| 9570879 | Optical pulse-generator and optical pulse-generating method | Tokutaka Hara | 2017-02-14 |
| 9523872 | Optical device | Toshio Kataoka, Norikazu Miyazaki | 2016-12-20 |
| 9250455 | Optical modulator | Kaoru Higuma, Tetsuya Kawanishi, Atsushi Kanno | 2016-02-02 |
| 8909001 | Optical modulator | Norikazu Miyazaki, Motohiro Takemura | 2014-12-09 |
| 8119737 | Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2012-02-21 |
| 7947779 | Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer | Teiichi Inada, Keiji Sumiya, Takeo Tomiyama, Tetsurou Iwakura, Hiroyuki Kawakami +6 more | 2011-05-24 |
| 7449076 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Shinji Iioka, Satoru Yanagisawa | 2008-11-11 |
| 7273654 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Shinji Iioka, Satoru Yanagisawa | 2007-09-25 |
| 6523446 | Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame | Yoshiyuki Tanabe, Yoshihiro Nomura, Hiroshi Kirihara, Shinji Iioka, Satoru Yanagisawa | 2003-02-25 |